Thermal conductivity of powder silica hollow spheres
文献类型：期刊论文
| 作者 | Liao, Yuchao1,2; Wu, Xiaofeng1; Liu, Haidi1; Chen, Yunfa1
|
| 刊名 | THERMOCHIMICA ACTA
 |
| 出版日期 | 2011-11-10 |
| 卷号 | 526期号:1-2页码:178-184 |
| 关键词 | Numerical analysis Thermal conductivity Powder silica hollow spheres Finite element analysis |
| ISSN号 | 0040-6031 |
| 通讯作者 | Chen, YF |
| 英文摘要 | The thermophysical property of hollow silica spheres was studied by the experimental test 3 omega method, theoretical calculation and finite element simulation. The experimental values of the thermal conductivity, less than 0.02 Wm(-1) K-1, indicated that the powder silica hollow spheres are indeed the high efficient heat-insulating materials. The influences of the particle size and packing density on the thermal conductivity were observed. Then the formula interpreting aerogels were used to calculate the thermal conductivity of hollow silica spheres. The calculated values were larger than the experimental ones. Moreover, ANSYS software was applied to develop a heat conduction model for this type materials based on their hollow structure features. The geometry of the materials was discrete and finite element analysis was performed. The simulated values were close to that of air and a little higher than the experimental and calculated ones. And the possible reasons causing such differences were proposed. (C) 2011 Elsevier B.V. All rights reserved. |
| WOS标题词 | Science & Technology ; Physical Sciences |
| 类目[WOS] | Chemistry, Analytical ; Chemistry, Physical |
| 研究领域[WOS] | Chemistry |
| 关键词[WOS] | ORGANIC AEROGELS ; FINITE-ELEMENT ; HEAT-TRANSFER |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000298274300026 |
| 公开日期 | 2013-10-28 |
| 版本 | 出版稿 |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/4337]  |
| 专题 | 过程工程研究所_多相复杂系统国家重点实验室 |
| 作者单位 | 1.Chinese Acad Sci, Inst Proc Engn, State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China 2.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China |
| 推荐引用方式 GB/T 7714 | Liao, Yuchao,Wu, Xiaofeng,Liu, Haidi,et al. Thermal conductivity of powder silica hollow spheres[J]. THERMOCHIMICA ACTA,2011,526(1-2):178-184. |
| APA | Liao, Yuchao,Wu, Xiaofeng,Liu, Haidi,&Chen, Yunfa.(2011).Thermal conductivity of powder silica hollow spheres.THERMOCHIMICA ACTA,526(1-2),178-184. |
| MLA | Liao, Yuchao,et al."Thermal conductivity of powder silica hollow spheres".THERMOCHIMICA ACTA 526.1-2(2011):178-184. |
入库方式： OAI收割
来源：过程工程研究所
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