Thermal-mechanical interface crack behaviour of a surface mount solder joint
文献类型：期刊论文
| 作者 | Wu CML; Lai JKL; Wu YL(吴永礼)
|
| 刊名 | Finite Elements in Analysis and Design
 |
| 出版日期 | 1998 |
| 卷号 | 30期号:1-2页码:19-30 |
| ISSN号 | 0168-874X |
| 通讯作者 | Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China. |
| 中文摘要 | The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis. The thermal effect was taken as cooling from the solder eutectic temperature to room temperature. Mechanical loading at the ends of the PCB was also applied. The results showed that cooling had the effect of causing large residual shear displacement at the region near the interface cracks. The mechanical loading caused additional crack opening displacements. The analysis on the values of J-integral for the interface cracks showed that J-integral was approximately path independent, and that the effect of crack at the solder/PCB interface is much more serious than that between the component and solder. |
| 学科主题 | 力学 |
| 类目[WOS] | Mathematics, Applied ; Mechanics |
| 研究领域[WOS] | Mathematics ; Mechanics |
| 关键词[WOS] | BONDED JOINTS |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000075181400003 |
| 公开日期 | 2007-06-15 ; 2007-12-05 ; 2009-06-23 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/16074]  |
| 专题 | 力学研究所_力学所知识产出(1956-2008) |
| 推荐引用方式 GB/T 7714 | Wu CML,Lai JKL,Wu YL. Thermal-mechanical interface crack behaviour of a surface mount solder joint[J]. Finite Elements in Analysis and Design,1998,30(1-2):19-30. |
| APA | Wu CML,Lai JKL,&吴永礼.(1998).Thermal-mechanical interface crack behaviour of a surface mount solder joint.Finite Elements in Analysis and Design,30(1-2),19-30. |
| MLA | Wu CML,et al."Thermal-mechanical interface crack behaviour of a surface mount solder joint".Finite Elements in Analysis and Design 30.1-2(1998):19-30. |
入库方式： OAI收割
来源：力学研究所
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