A New Crack Healing Kinetic Model and Application of Crack Healing Diagram
文献类型：期刊论文
| 作者 | Y. Kan ; H. Liu ; S. H. Zhang ; L. W. Zhang ; M. Cheng |
| 刊名 | Journal of Manufacturing Science and Engineering-Transactions of the Asme
 |
| 出版日期 | 2013 |
| 卷号 | 135期号:5 |
| 关键词 | crack healing model healing diagram crack surface topography grain growth sintering kinetics numerical-analysis diffusion shrinkage surface grain |
| ISSN号 | 1087-1357 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2013-12-24 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/71289]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Y. Kan,H. Liu,S. H. Zhang,et al. A New Crack Healing Kinetic Model and Application of Crack Healing Diagram[J]. Journal of Manufacturing Science and Engineering-Transactions of the Asme,2013,135(5). |
| APA | Y. Kan,H. Liu,S. H. Zhang,L. W. Zhang,&M. Cheng.(2013).A New Crack Healing Kinetic Model and Application of Crack Healing Diagram.Journal of Manufacturing Science and Engineering-Transactions of the Asme,135(5). |
| MLA | Y. Kan,et al."A New Crack Healing Kinetic Model and Application of Crack Healing Diagram".Journal of Manufacturing Science and Engineering-Transactions of the Asme 135.5(2013). |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。