The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy
文献类型：期刊论文
| 作者 | C. F. Li ; Z. Q. Liu ; J. K. Shang |
| 刊名 | Journal of Alloys and Compounds
 |
| 出版日期 | 2013 |
| 卷号 | 550页码:231-238 |
| 关键词 | Tin whisker Hillock NdSn3 Oxidation Growth mechanism lead-free solder electron-microscopy nd addition sn-whiskers joints mechanisms |
| ISSN号 | 0925-8388 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2013-12-24 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/71308]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | C. F. Li,Z. Q. Liu,J. K. Shang. The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy[J]. Journal of Alloys and Compounds,2013,550:231-238. |
| APA | C. F. Li,Z. Q. Liu,&J. K. Shang.(2013).The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy.Journal of Alloys and Compounds,550,231-238. |
| MLA | C. F. Li,et al."The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy".Journal of Alloys and Compounds 550(2013):231-238. |
入库方式： OAI收割
来源：金属研究所
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