Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect
文献类型：期刊论文
| 作者 | H. Y. Liu ; Q. S. Zhu ; Z. G. Wang ; J. D. Guo ; J. K. Shang |
| 刊名 | Journal of Materials Science-Materials in Electronics
 |
| 出版日期 | 2013 |
| 卷号 | 24期号:1页码:211-216 |
| 关键词 | intermetallic compound formation sn-3.8ag-0.7cu solder cu microstructure joints |
| ISSN号 | 0957-4522 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2013-12-24 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/71367]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. Y. Liu,Q. S. Zhu,Z. G. Wang,et al. Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect[J]. Journal of Materials Science-Materials in Electronics,2013,24(1):211-216. |
| APA | H. Y. Liu,Q. S. Zhu,Z. G. Wang,J. D. Guo,&J. K. Shang.(2013).Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect.Journal of Materials Science-Materials in Electronics,24(1),211-216. |
| MLA | H. Y. Liu,et al."Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect".Journal of Materials Science-Materials in Electronics 24.1(2013):211-216. |
入库方式： OAI收割
来源：金属研究所
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