中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries

文献类型:期刊论文

作者N. C. Sheng ; J. D. Liu ; T. Jin ; X. F. Sun ; Z. Q. Hu
刊名Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science
出版日期2013
卷号44A期号:4页码:1793-1804
关键词inconel 738lc superalloy isothermal solidification b system transient temperature joint
ISSN号1073-5623
原文出处://WOS:000315433700021
语种英语
公开日期2013-12-24
源URL[http://ir.imr.ac.cn/handle/321006/71453]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
N. C. Sheng,J. D. Liu,T. Jin,et al. Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries[J]. Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science,2013,44A(4):1793-1804.
APA N. C. Sheng,J. D. Liu,T. Jin,X. F. Sun,&Z. Q. Hu.(2013).Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries.Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science,44A(4),1793-1804.
MLA N. C. Sheng,et al."Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries".Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science 44A.4(2013):1793-1804.

入库方式: OAI收割

来源:金属研究所

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