Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries
文献类型:期刊论文
作者 | N. C. Sheng ; J. D. Liu ; T. Jin ; X. F. Sun ; Z. Q. Hu |
刊名 | Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science
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出版日期 | 2013 |
卷号 | 44A期号:4页码:1793-1804 |
关键词 | inconel 738lc superalloy isothermal solidification b system transient temperature joint |
ISSN号 | 1073-5623 |
原文出处 | |
语种 | 英语 |
公开日期 | 2013-12-24 |
源URL | [http://ir.imr.ac.cn/handle/321006/71453] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | N. C. Sheng,J. D. Liu,T. Jin,et al. Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries[J]. Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science,2013,44A(4):1793-1804. |
APA | N. C. Sheng,J. D. Liu,T. Jin,X. F. Sun,&Z. Q. Hu.(2013).Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries.Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science,44A(4),1793-1804. |
MLA | N. C. Sheng,et al."Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries".Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science 44A.4(2013):1793-1804. |
入库方式: OAI收割
来源:金属研究所
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