Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction
文献类型：期刊论文
| 作者 | L. M. Yang ; Z. F. Zhang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2013 |
| 卷号 | 42期号:12页码:3552-3558 |
| 关键词 | Lead-free solder intermetallic compounds interfacial reaction grain growth sn-ag-cu shear-strength mechanical-properties rare-earth bga joints alloy electromigration reliability |
| ISSN号 | 0361-5235 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2013-12-24 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/71631]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | L. M. Yang,Z. F. Zhang. Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction[J]. Journal of Electronic Materials,2013,42(12):3552-3558. |
| APA | L. M. Yang,&Z. F. Zhang.(2013).Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction.Journal of Electronic Materials,42(12),3552-3558. |
| MLA | L. M. Yang,et al."Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction".Journal of Electronic Materials 42.12(2013):3552-3558. |
入库方式： OAI收割
来源：金属研究所
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