Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude
文献类型：期刊论文
| 作者 | Q. K. Zhang ; Z. F. Zhang |
| 刊名 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| 出版日期 | 2013 |
| 卷号 | 580页码:374-384 |
| 关键词 | Sn-Ag/Cu solder joints Thermal fatigue Strain localization Grain rotation Dynamic recovery stress-relaxation behavior eutectic sn-3.5ag solder lead-free solders pb-free solders sn-ag tensile properties shear-strength fracture-behavior deformation creep |
| ISSN号 | 0921-5093 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2013-12-24 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/71692]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. K. Zhang,Z. F. Zhang. Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2013,580:374-384. |
| APA | Q. K. Zhang,&Z. F. Zhang.(2013).Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,580,374-384. |
| MLA | Q. K. Zhang,et al."Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 580(2013):374-384. |
入库方式： OAI收割
来源：金属研究所
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