Wettability of molten Sn-Bi-Cu solder on Cu substrate
文献类型：期刊论文
| 作者 | Zang, Likun1,2,4; Yuan, Zhangfu2,3; Zhao, Hongxin2,4; Zhang, Xiaorui4 |
| 刊名 | MATERIALS LETTERS
 |
| 出版日期 | 2009-09-30 |
| 卷号 | 63期号:23页码:2067-2069 |
| 关键词 | Electronic materials Metals and alloys Intermetallic compound Wettability |
| ISSN号 | 0167-577X |
| 通讯作者 | Zang, LK |
| 英文摘要 | The wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile drop method under an Ar-H(2) flow in the temperature range from 493 K to 623 K. The contact angle curves tested at 548 K and 623 K are found to fit exponential rule very well. However. the contact angle curve tested under493 K is not well consistent with exponential rule, for which the spreading course may be classified into three stages. Equilibrium contact angles between Sn-Bi-Cu solder and Cu substrate decrease monotonously with the increase in temperature, which are 28 degrees, 24 degrees and 18 degrees at 493 K. 548 K and 623 K, respectively. The results show that 69.5Sn30Bi-0.5Cu/exhibits good wettability on Cu substrate. Intermetallics formed at the 69.5Sn-30Bi-0.5Cu/Cu interface are identified as Cu(6)Sn(5) adjacent to the solder and Cu(3)Sn adjacent to the Cu substrate, respectively. Formation of intermetallic seems to improve strong wetting of the substrate by the solder. (C) 2009 Elsevier B.V. All rights reserved. |
| WOS标题词 | Science & Technology ; Technology ; Physical Sciences |
| 类目[WOS] | Materials Science, Multidisciplinary ; Physics, Applied |
| 研究领域[WOS] | Materials Science ; Physics |
| 关键词[WOS] | LEAD-FREE SOLDERS ; INTERFACIAL REACTIONS ; SURFACE-TENSION ; TEMPERATURE-COEFFICIENT ; ALLOY ; ZN ; AG |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000269174900029 |
| 公开日期 | 2013-11-29 |
| 版本 | 出版稿 |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/6580]  |
| 专题 | 过程工程研究所_多相复杂系统国家重点实验室 |
| 作者单位 | 1.Univ Sci & Technol Beijing, Sch Appl Sci, Beijing 100083, Peoples R China 2.Chinese Acad Sci, State Key Lab Multiphase Complex Syst, Inst Proc Engn, Beijing 100190, Peoples R China 3.Peking Univ, Coll Engn, Dept Energy & Resources Engn, Beijing 100871, Peoples R China 4.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zang, Likun,Yuan, Zhangfu,Zhao, Hongxin,et al. Wettability of molten Sn-Bi-Cu solder on Cu substrate[J]. MATERIALS LETTERS,2009,63(23):2067-2069. |
| APA | Zang, Likun,Yuan, Zhangfu,Zhao, Hongxin,&Zhang, Xiaorui.(2009).Wettability of molten Sn-Bi-Cu solder on Cu substrate.MATERIALS LETTERS,63(23),2067-2069. |
| MLA | Zang, Likun,et al."Wettability of molten Sn-Bi-Cu solder on Cu substrate".MATERIALS LETTERS 63.23(2009):2067-2069. |
入库方式： OAI收割
来源：过程工程研究所
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