Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
文献类型：期刊论文
| 作者 | Zhang XiaoRui1,2; Yuan ZhangFu1,2; Zhao HongXin2; Zang LiKun2; Li JianQiang2 |
| 刊名 | CHINESE SCIENCE BULLETIN
 |
| 出版日期 | 2010-03-01 |
| 卷号 | 55期号:9页码:797-801 |
| 关键词 | contact angle lead-free solder sessile drop method Sn-Ag-Cu intermetallic compounds |
| ISSN号 | 1001-6538 |
| 其他题名 | Chin. Sci. Bull. |
| 中文摘要 | Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy's melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample's cross section. Intermetallic compounds of Cu(6)Sn(5) and beta-Sn phase were found at the interface of Sn-Ag-Cu/Cu. |
| 英文摘要 | Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy's melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample's cross section. Intermetallic compounds of Cu(6)Sn(5) and beta-Sn phase were found at the interface of Sn-Ag-Cu/Cu. |
| WOS标题词 | Science & Technology |
| 类目[WOS] | Multidisciplinary Sciences |
| 研究领域[WOS] | Science & Technology - Other Topics |
| 关键词[WOS] | LEAD-FREE SOLDERS ; SESSILE DROP METHOD ; SURFACE-TENSION ; INTERMETALLIC COMPOUNDS ; BI SOLDER ; CREEP |
| 收录类别 | SCI |
| 原文出处 | |
| 语种 | 英语 |
| WOS记录号 | WOS:000275821800003 |
| 公开日期 | 2013-11-28 |
| 版本 | 出版稿 |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/6523]  |
| 专题 | 过程工程研究所_研究所（批量导入） |
| 作者单位 | 1.Peking Univ, Coll Engn, Dept Energy & Resources Engn, Beijing 100871, Peoples R China 2.Chinese Acad Sci, Inst Proc Engn, State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang XiaoRui,Yuan ZhangFu,Zhao HongXin,et al. Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate[J]. CHINESE SCIENCE BULLETIN,2010,55(9):797-801. |
| APA | Zhang XiaoRui,Yuan ZhangFu,Zhao HongXin,Zang LiKun,&Li JianQiang.(2010).Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate.CHINESE SCIENCE BULLETIN,55(9),797-801. |
| MLA | Zhang XiaoRui,et al."Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate".CHINESE SCIENCE BULLETIN 55.9(2010):797-801. |
入库方式： OAI收割
来源：过程工程研究所
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