中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
A TRANSMISSION ELECTRON-MICROSCOPIC STUDY OF TITANIUM SILICIDES FABRICATED BY IMPLANTATION OF TITANIUM INTO SILICON AND THERMAL ANNEALING

文献类型:期刊论文

作者JIN, S ; WEN, XY ; ZHANG, Z
刊名THIN SOLID FILMS
出版日期1994
卷号249期号:1页码:50
关键词(111)SI TISI2
ISSN号0040-6090
通讯作者JIN, S: CHINESE ACAD SCI,BEIJING LAB ELECTRON MICROSCOPY,POB 2724,BEIJING 100080,PEOPLES R CHINA.
中文摘要Titanium silicide has been formed by ion implantation of titanium into high purity silicon (111) and thermally annealed in ambient Ar. Cross-sectional transmission electron microscopy (XTEM) shows that the silicon annealed at 1000 degrees C consists of three parts: an intermittent C54-TiSi2 layer, a region of buried C49-TiSi2 precipitates and a residual radiation- damaged zone. For the sample annealed at 700 degrees C there is a continuous C54-TiSi2 layer and a zone of buried crystals below the silicide layer. After thermal annealing at 800 degrees C for 30 min, only a continuous C54-TiSi2 layer is present in the silicon substrate surface and its orientation relationships are determined as [121]C54-TiSi2 parallel to[110]Si and (111)C54-TiSi2 parallel to(111)Si. High resolution electron microscopy (HREM) reveals that there is a transition layer which may relax the strain caused by the lattice misfit between the C54-TiSi2 film and the silicon substrate.
收录类别SCI
语种英语
公开日期2013-09-17
源URL[http://ir.iphy.ac.cn/handle/311004/33324]  
专题物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文
推荐引用方式
GB/T 7714
JIN, S,WEN, XY,ZHANG, Z. A TRANSMISSION ELECTRON-MICROSCOPIC STUDY OF TITANIUM SILICIDES FABRICATED BY IMPLANTATION OF TITANIUM INTO SILICON AND THERMAL ANNEALING[J]. THIN SOLID FILMS,1994,249(1):50.
APA JIN, S,WEN, XY,&ZHANG, Z.(1994).A TRANSMISSION ELECTRON-MICROSCOPIC STUDY OF TITANIUM SILICIDES FABRICATED BY IMPLANTATION OF TITANIUM INTO SILICON AND THERMAL ANNEALING.THIN SOLID FILMS,249(1),50.
MLA JIN, S,et al."A TRANSMISSION ELECTRON-MICROSCOPIC STUDY OF TITANIUM SILICIDES FABRICATED BY IMPLANTATION OF TITANIUM INTO SILICON AND THERMAL ANNEALING".THIN SOLID FILMS 249.1(1994):50.

入库方式: OAI收割

来源:物理研究所

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