Formation of copper electrodeposits on an untreated insulating substrate
文献类型：期刊论文
| 作者 | Zhang, MZ ; Wang, Y ; Yu, GW ; Wang, M ; Peng, RW ; Weng, YY ; Ming, NB |
| 刊名 | JOURNAL OF PHYSICS-CONDENSED MATTER
 |
| 出版日期 | 2004 |
| 卷号 | 16期号:4页码:695 |
| 关键词 | ELECTROCHEMICAL DEPOSITION LAYERED NANOSTRUCTURES POTENTIAL OSCILLATIONS GROWTH |
| ISSN号 | 0953-8984 |
| 通讯作者 | Wang, M: Nanjing Univ, Natl Lab Solid State Microstruct, Nanjing 210093, Peoples R China. |
| 中文摘要 | We report here the electrodeposition of copper on an insulating glass substrate without introducing additives into the electrolyte and/or metallic clusters on the surface of the substrate. The deposit morphology, which varies from compact film to dense-branching patterns, can be achieved by changing the concentration and pH of the electrolyte, and the electric current in electrodeposition. The grain size of the electrodeposits is analysed for various growth conditions. We find that finer copper grains can be easily achieved at large electric current, high pH and low electrolyte concentration. We explain, using the theory of nucleation, why a metallic layer may develop horizontally over an insulating glass plate. |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2013-09-17 |
| 源URL | [http://ir.iphy.ac.cn/handle/311004/38391]  |
| 专题 | 物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文 |
| 推荐引用方式 GB/T 7714 | Zhang, MZ,Wang, Y,Yu, GW,et al. Formation of copper electrodeposits on an untreated insulating substrate[J]. JOURNAL OF PHYSICS-CONDENSED MATTER,2004,16(4):695. |
| APA | Zhang, MZ.,Wang, Y.,Yu, GW.,Wang, M.,Peng, RW.,...&Ming, NB.(2004).Formation of copper electrodeposits on an untreated insulating substrate.JOURNAL OF PHYSICS-CONDENSED MATTER,16(4),695. |
| MLA | Zhang, MZ,et al."Formation of copper electrodeposits on an untreated insulating substrate".JOURNAL OF PHYSICS-CONDENSED MATTER 16.4(2004):695. |
入库方式： OAI收割
来源：物理研究所
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