中国科学院机构知识库网格
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Reducing the resistivity of electron and ion beam assisted deposited Pt

文献类型:期刊论文

作者Langford, RM ; Wang, TX ; Ozkaya, D
刊名MICROELECTRONIC ENGINEERING
出版日期2007
卷号84期号:5-8页码:784
ISSN号0167-9317
中文摘要Dual platform (FIB/SEM) systems can be used to deposit platinum by both ion and electron beam assisted deposition by the breakdown of a suitable inorganic metallic precursor. The resistivity of electron beam deposited Pt is typically 2-3 orders of magnitude higher than that of the ion beam deposited Pt. Experiments to determine the cause of the difference in the resistivity and to decrease the resistivity of electron beam deposited Pt are reported. Changing the dwell times and incident energy did not affect the resistivity of the deposited Pt. Both annealing at 500 degrees C in forming gas (H-2/N-2) and implanting electron beam deposited Pt with gallium reduced its resistivity by a factor of 10. From the microstructure and chemical analysis and transport measurements, it is concluded that the difference in resistivity is due to the differences in the nanostructure and chemical composition and due to the presence of gallium. (c) 2007 Elsevier B.V. All rights reserved.
收录类别SCI
公开日期2013-09-24
源URL[http://ir.iphy.ac.cn/handle/311004/51967]  
专题物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文
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GB/T 7714
Langford, RM,Wang, TX,Ozkaya, D. Reducing the resistivity of electron and ion beam assisted deposited Pt[J]. MICROELECTRONIC ENGINEERING,2007,84(5-8):784.
APA Langford, RM,Wang, TX,&Ozkaya, D.(2007).Reducing the resistivity of electron and ion beam assisted deposited Pt.MICROELECTRONIC ENGINEERING,84(5-8),784.
MLA Langford, RM,et al."Reducing the resistivity of electron and ion beam assisted deposited Pt".MICROELECTRONIC ENGINEERING 84.5-8(2007):784.

入库方式: OAI收割

来源:物理研究所

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