Residual stress assessment of interconnects by slot milling with FIB and geometric phase analysis
文献类型：期刊论文
| 作者 | Wang, QH ; Xie, HM ; Liu, ZW ; Lou, XH ; Wang, JF ; Xu, KW ; Zhang, ZH ; Liao, JH ; Gu, CZ |
| 刊名 | OPTICS AND LASERS IN ENGINEERING
 |
| 出版日期 | 2010 |
| 卷号 | 48期号:11页码:1113 |
| ISSN号 | 0143-8166 |
| 关键词 | THIN-FILMS DISPLACEMENT MICROGRAPHS MICROSCOPY FIELDS HRTEM |
| 通讯作者 | Xie, HM (reprint author), Tsinghua Univ, AML, Dept Engn Mech, Beijing 100084, Peoples R China. |
| 中文摘要 | Based on the combined milling-imaging capabilities of focused ion-beam equipment, a novel approach of measuring residual stress of interconnects by slot milling and geometric phase analysis is presented. This method is performed through measuring the displacement field perpendicular to the slot due to the stress release by geometric phase analysis, and then solving the residual stress along the Interconnect line by finite element method Grating fabrication, slot milling and micrographs capturing are implemented in focused ion-beam equipment The displacement at the edge of the slot and the residual stress of a copper interconnect line were found to be in the range 26-45 nm and 265-467 MPa, respectively. This work provides an effective way to determine the residual stress of film lines (C) 2009 Elsevier Ltd. All rights reserved |
| 资助信息 | National Basic Research Program of China [2010CB631005]; National Natural Science Foundation of China [10625209, 10732080, 90916010]; Beijing Natural Sciences Foundation [3072007]; Beijing Key Laboratory for Nano-photonics and Nano-structure; Laboratory of Micro-fabrication (LMF), Institute of Physics, CAS |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2013-09-24 |
| 源URL | [http://ir.iphy.ac.cn/handle/311004/52093]  |
| 专题 | 物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wang, QH,Xie, HM,Liu, ZW,et al. Residual stress assessment of interconnects by slot milling with FIB and geometric phase analysis[J]. OPTICS AND LASERS IN ENGINEERING,2010,48(11):1113. |
| APA | Wang, QH.,Xie, HM.,Liu, ZW.,Lou, XH.,Wang, JF.,...&Gu, CZ.(2010).Residual stress assessment of interconnects by slot milling with FIB and geometric phase analysis.OPTICS AND LASERS IN ENGINEERING,48(11),1113. |
| MLA | Wang, QH,et al."Residual stress assessment of interconnects by slot milling with FIB and geometric phase analysis".OPTICS AND LASERS IN ENGINEERING 48.11(2010):1113. |
入库方式： OAI收割
来源：物理研究所
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