Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages
文献类型：会议论文
| 作者 | Liu S; Zhao YP(赵亚溥) ; Zhao YP(赵亚溥); Liu S; Liu S; Wang HY(汪海英); Wang HY(汪海英)
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| 出版日期 | 2001 |
| 会议名称 | Fourth International Symposium on Electronic Packaging Technology |
| 会议日期 | 2001-8-8 |
| 会议地点 | 北京/Beijing, China |
| 关键词 | solder underfill filled 0 outmost substrate 0 fatigue Package understand joints thermal lives 0 silicon reliability range 0 different smaller corners studied assumed simulation |
| 页码 | 394-398 |
| 中文摘要 | A finite element framework is established with the consideration of complete and different incomplete filled flip-chip package models.A nonlinear finite element technique,in which the viscoplastic material properties(strain rate dependent) of solder balls and underfill are considered,is adapted t... |
| 会议录 | Proceedings of the Fourth International Symposium on Electronic Packaging Technology
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| 语种 | 英语 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/48194]  |
| 专题 | 力学研究所_力学所知识产出(1956-2008) |
| 推荐引用方式 GB/T 7714 | Liu S,Zhao YP,Zhao YP,et al. Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages[C]. 见:Fourth International Symposium on Electronic Packaging Technology. 北京/Beijing, China. 2001-8-8. |
入库方式： OAI收割
来源：力学研究所
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