Film residual stress assessment method via temporarily thermal relaxation
文献类型：会议论文
| 作者 | Wu CW(吴臣武) ; Cheng XX(程欣欣)
|
| 出版日期 | 2013 |
| 会议名称 | 2012 Annual Conference on Experimental and Applied Mechanics |
| 会议日期 | JUN 11-14, 2012 |
| 会议地点 | Costa Mesa, CA, United states |
| 通讯作者邮箱 | chenwuwu@imech.ac.cn |
| 关键词 | Film Residual stress Assessment Temporarily thermal relaxation |
| 卷号 | 4 |
| 页码 | 267-276 |
| 通讯作者 | 吴臣武 |
| 中文摘要 | The concept of temporarily thermal relaxation is extended theoretically to assess the film residual stress. First, the contribution of the initial stress to the observable displacement field is separated with eliminating the thermal expansion effect of the material. Then, the residual stress is inversely derived through the displacement increment. Finally, finite element analysis was carried out to provide numerical description of the partial relieve of the residual stress. |
| 收录类别 | EI |
| 会议网址 | http://dx.doi.org/10.1007/978-1-4614-4226-4_31 |
| 会议录 | Experimental and Applied Mechanics - Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics
 |
| 会议录出版者 | SPRINGER NEW YORK |
| 语种 | 英语 |
| ISSN号 | 2191-5644 |
| ISBN号 | 978-1-4614-4225-7 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/48265]  |
| 专题 | 力学研究所_先进制造工艺力学重点实验室 |
| 通讯作者 | Wu CW(吴臣武) |
| 推荐引用方式 GB/T 7714 | Wu CW,Cheng XX. Film residual stress assessment method via temporarily thermal relaxation[C]. 见:2012 Annual Conference on Experimental and Applied Mechanics. Costa Mesa, CA, United states. JUN 11-14, 2012.http://dx.doi.org/10.1007/978-1-4614-4226-4_31. |
入库方式： OAI收割
来源：力学研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。