Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate
文献类型：期刊论文
| 作者 | F. F. Tian ; Z. Q. Liu |
| 刊名 | Journal of Alloys and Compounds
 |
| 出版日期 | 2014 |
| 卷号 | 588页码:662-667 |
| 关键词 | 48Sn52In IMC Morphology Orientation relationship EBSD interfacial reactions soldering reaction joint reliability void formation solid-state sn cu3sn alloy creep |
| ISSN号 | 0925-8388 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2014-03-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/72497]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | F. F. Tian,Z. Q. Liu. Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate[J]. Journal of Alloys and Compounds,2014,588:662-667. |
| APA | F. F. Tian,&Z. Q. Liu.(2014).Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate.Journal of Alloys and Compounds,588,662-667. |
| MLA | F. F. Tian,et al."Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate".Journal of Alloys and Compounds 588(2014):662-667. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。