Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites
文献类型：期刊论文
| 作者 | Y. Kan ; Z. G. Liu ; S. H. Zhang ; L. W. Zhang ; M. Cheng ; H. W. Song |
| 刊名 | Journal of Materials Engineering and Performance
 |
| 出版日期 | 2014 |
| 卷号 | 23期号:3页码:1069-1076 |
| 关键词 | damage evolution interface debonding microstructure-based model SiCp/Al composites metal-matrix composites computational micromechanics mechanical-behavior damage model property deformation decohesion fracture flow |
| ISSN号 | 1059-9495 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2014-04-18 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/72549]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Y. Kan,Z. G. Liu,S. H. Zhang,et al. Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites[J]. Journal of Materials Engineering and Performance,2014,23(3):1069-1076. |
| APA | Y. Kan,Z. G. Liu,S. H. Zhang,L. W. Zhang,M. Cheng,&H. W. Song.(2014).Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites.Journal of Materials Engineering and Performance,23(3),1069-1076. |
| MLA | Y. Kan,et al."Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites".Journal of Materials Engineering and Performance 23.3(2014):1069-1076. |
入库方式： OAI收割
来源：金属研究所
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