Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging
文献类型：期刊论文
| 作者 | Z. Q. Liu ; P. J. Shang ; F. F. Tan ; D. X. Li |
| 刊名 | Microscopy and Microanalysis
 |
| 出版日期 | 2013 |
| 卷号 | 19页码:105-108 |
| 关键词 | lead-free solder Kirkendall void intermetallic compound (IMC) diffusion interface transmission electron microscopy (TEM) cu |
| ISSN号 | 1431-9276 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2014-04-18 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/72559]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Z. Q. Liu,P. J. Shang,F. F. Tan,et al. Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging[J]. Microscopy and Microanalysis,2013,19:105-108. |
| APA | Z. Q. Liu,P. J. Shang,F. F. Tan,&D. X. Li.(2013).Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging.Microscopy and Microanalysis,19,105-108. |
| MLA | Z. Q. Liu,et al."Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging".Microscopy and Microanalysis 19(2013):105-108. |
入库方式： OAI收割
来源：金属研究所
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