Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate
文献类型：期刊论文
| 作者 | F. F. Tian ; Z. Q. Liu ; P. J. Shang ; J. D. Guo |
| 刊名 | Journal of Alloys and Compounds
 |
| 出版日期 | 2014 |
| 卷号 | 591页码:351-355 |
| 关键词 | Phase identification Interface IMC Eutectic SnIn solder Single crystalline Cu gamma-angular correlations lead-free solders joint reliability growth-kinetics system equilibria mechanisms interfaces diffusion layer |
| ISSN号 | 0925-8388 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2014-04-18 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/72580]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | F. F. Tian,Z. Q. Liu,P. J. Shang,et al. Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate[J]. Journal of Alloys and Compounds,2014,591:351-355. |
| APA | F. F. Tian,Z. Q. Liu,P. J. Shang,&J. D. Guo.(2014).Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate.Journal of Alloys and Compounds,591,351-355. |
| MLA | F. F. Tian,et al."Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate".Journal of Alloys and Compounds 591(2014):351-355. |
入库方式： OAI收割
来源：金属研究所
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