中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer

文献类型:期刊论文

作者Chen, Bo
刊名ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3
出版日期2013
卷号655-657页码:84-87
关键词Thermal simulation Thermal analysis CAE Derated maximum junction temperature
ISSN号1662-8985
通讯作者Chen, B (reprint author), Chinese Acad Sci, Natl Space Sci Ctr, Beijing 100190, Peoples R China.
中文摘要Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45℃ to63.9℃ in the digital control equipment and 45℃ to 68.7℃ in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1℃, which is allowed for engineering application.
英文摘要Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45 degrees C to63.9 degrees C in the digital control equipment and 45 degrees C to 68.7 degrees C in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1 degrees C, which is allowed for engineering application.
学科主题微波遥感
会议名称3rd International Conference on Advances in Materials Manufacturing (ICAMMP 2012)
收录类别EI ; CPCI
资助信息Univ Wollongong, NE Univ, Univ Sci & Technol
会议地点Beihai, PEOPLES R CHINA
会议日期DEC 22-23, 2012
语种英语
ISBN号978-3-03785-648-2
出版者TRANS TECH PUBLICATIONS LTD
源URL[http://ir.cssar.ac.cn/handle/122/2055]  
专题国家空间科学中心_微波遥感部
推荐引用方式
GB/T 7714
Chen, Bo. Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer[J]. ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3,2013,655-657:84-87.
APA Chen, Bo.(2013).Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer.ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3,655-657,84-87.
MLA Chen, Bo."Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer".ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3 655-657(2013):84-87.

入库方式: OAI收割

来源:国家空间科学中心

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