Isothermal solidification stage during transient liquid-phase bonding single-crystal superalloys
文献类型：期刊论文
| 作者 | N. C. Sheng ; J. D. Liu ; T. Jin ; X. F. Sun ; Z. Q. Hu |
| 刊名 | Philosophical Magazine
 |
| 出版日期 | 2014 |
| 卷号 | 94期号:11页码:1219-1234 |
| 关键词 | single crystal superalloys TLP bonding isothermal solidification inconel 738lc superalloy grain-boundaries wide-gap temperature evolution joints nickel system metal |
| ISSN号 | 1478-6435 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2014-07-03 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/72900]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | N. C. Sheng,J. D. Liu,T. Jin,et al. Isothermal solidification stage during transient liquid-phase bonding single-crystal superalloys[J]. Philosophical Magazine,2014,94(11):1219-1234. |
| APA | N. C. Sheng,J. D. Liu,T. Jin,X. F. Sun,&Z. Q. Hu.(2014).Isothermal solidification stage during transient liquid-phase bonding single-crystal superalloys.Philosophical Magazine,94(11),1219-1234. |
| MLA | N. C. Sheng,et al."Isothermal solidification stage during transient liquid-phase bonding single-crystal superalloys".Philosophical Magazine 94.11(2014):1219-1234. |
入库方式： OAI收割
来源：金属研究所
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