Separation of Copper Foils and Base Plates from Waste Printed Circuit Boards by Chemical Swelling Method
文献类型：会议论文
| 作者 | Cao, H. B.; Zhang, X. H.; Liu, H. L. |
| 出版日期 | 2010 |
| 会议名称 | 5th International Conference on Waste Management and Technology |
| 会议日期 | DEC 15-17, 2010 |
| 会议地点 | Beijing, PEOPLES R CHINA |
| 关键词 | waste printed circuit boards chemical swelling peeling strength monomer liberation degree ELECTRONIC SCRAP RECOVERY EQUIPMENT METALS |
| 页码 | 309-313 |
| 中文摘要 | In this paper, ten kinds of chemical solvents were used to immerse the waste printed circuit boards (PCBs). Comparing the effects of chemical swelling solvents on the peeling strength between copper foils and base plates from PCBs, solvent D, solvent F, acetone and water were selected as the typical chemical swelling solvents. After chemical swelling treatment, the monomer liberation degree and scrapping time were further investigated to obtain particles with certain size distribution. The experimental results showed that scrapping after chemical swelling treatment could remarkably increase the monomer liberation degree of metals. The chemical swelling effects of the four solvents were in the sequence solvent D > solvent F > acetone > water. The longer time and higher temperature favored the decrease of peeling strength between copper foils and base plates from PCBs. The copper foils could fall off from the base plates spontaneously after immersing in solvent D at 150 degrees C for 3 h or at 140 degrees C for 5 h. This study demonstrated that chemical swelling treatment was very conductive to achieve higher monomer liberation degree of metals with coarser particle sizes. |
| 收录类别 | ISTP |
| 会议网址 | |
| 会议录 | SELECTED PROCEEDINGS OF THE FIFTH INTERNATIONAL CONFERENCE ON WASTE MANAGEMENT AND TECHNOLOGY(ICWMT 5) 页: 309-313
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| 会议录出版者 | Sci Res Publ, Inc-Srp |
| 语种 | 英语 |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/11071]  |
| 专题 | 过程工程研究所_研究所（批量导入） |
| 推荐引用方式 GB/T 7714 |
Cao, H. B.,Zhang, X. H.,Liu, H. L.. Separation of Copper Foils and Base Plates from Waste Printed Circuit Boards by Chemical Swelling Method[C]. 见:5th International Conference on Waste Management and Technology. Beijing, PEOPLES R CHINA. DEC 15-17, 2010. |
入库方式： OAI收割
来源：过程工程研究所
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