Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea
文献类型：期刊论文
| 作者 | Kang RX(康瑞雪)1,2; Liang J(梁军)1 ; Liu BX(刘百幸)1; Peng ZJ(彭振军)1
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| 刊名 | Journal of The Electrochemical Society
 |
| 出版日期 | 2014 |
| 卷号 | 161期号:10页码:D534-D539 |
| ISSN号 | 0013-4651 |
| 通讯作者 | 梁军 |
| 英文摘要 | The deposition of copper (Cu) on aluminum (Al) is important for submicron interconnects and plating treatments of Al-based substrate. While aqueous deposition of Cu on Al is challenging on several technological and environmental problems. In this paper, we described electroless deposition of Cu onto Al surface through galvanic replacement from a simple and stable choline chloride (ChCl) based ionic liquid comprising a 1:2 stoichiometric mixture of ChCl and ethylene glycol (EG). Thermodynamic feasibility of Cu deposition by galvanic replacement on Al in ChCl-EG ionic liquid was studied by cyclic voltammetry. The effect of thiourea (TU) on the kinetics of galvanic replacement and the characterization of Cu layers were investigated by open circuit potential (OCP), electrochemical noise (ECN), scanning electron microscopy (SEM) and X-ray diffraction (XRD). Results showed that sustained deposition of Cu on Al surface was achieved in both the ChCl-EG ionic liquid solutions without and with addition of TU. The presence of TU in the ionic liquid restrained the galvanic replacement process, resulting in obtaining a compact and uniform Cu layer on Al surface. |
| 学科主题 | 材料科学与物理化学 |
| 收录类别 | SCI |
| 资助信息 | the “Hundred Talents Program” of Chinese Academy of Sciences (J. Liang) |
| 语种 | 英语 |
| WOS记录号 | WOS:000341217500065 |
| 公开日期 | 2014-11-27 |
| 源URL | [http://210.77.64.217/handle/362003/6812]  |
| 专题 | 兰州化学物理研究所_固体润滑国家重点实验室 |
| 作者单位 | 1.Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100080, Peoples R China |
| 推荐引用方式 GB/T 7714 | Kang RX,Liang J,Liu BX,et al. Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea[J]. Journal of The Electrochemical Society,2014,161(10):D534-D539. |
| APA | Kang RX,Liang J,Liu BX,&Peng ZJ.(2014).Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea.Journal of The Electrochemical Society,161(10),D534-D539. |
| MLA | Kang RX,et al."Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea".Journal of The Electrochemical Society 161.10(2014):D534-D539. |
入库方式： OAI收割
来源：兰州化学物理研究所
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