Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes
文献类型：期刊论文
| ; | |
| 作者 | Ye, Huaiyu; Li, Bo; Tang, Hongyu; Zhao, Jia; Yuan, Cadmus; Zhang, Guoqi |
| 刊名 | microelectronics reliability
 ; MICROELECTRONICS RELIABILITY
|
| 出版日期 | 2014 ; 2014 |
| 卷号 | 54期号:11页码:2448-2455 |
| 学科主题 | 半导体器件 ; 半导体器件 |
| 收录类别 | SCI |
| 语种 | 英语 ; 英语 |
| 公开日期 | 2015-03-20 ; 2015-03-20 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/26085]  |
| 专题 | 半导体研究所_中科院半导体照明研发中心 |
| 推荐引用方式 GB/T 7714 | Ye, Huaiyu,Li, Bo,Tang, Hongyu,et al. Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes, Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes[J]. microelectronics reliability, MICROELECTRONICS RELIABILITY,2014, 2014,54, 54(11):2448-2455, 2448-2455. |
| APA | Ye, Huaiyu,Li, Bo,Tang, Hongyu,Zhao, Jia,Yuan, Cadmus,&Zhang, Guoqi.(2014).Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes.microelectronics reliability,54(11),2448-2455. |
| MLA | Ye, Huaiyu,et al."Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes".microelectronics reliability 54.11(2014):2448-2455. |
入库方式： OAI收割
来源：半导体研究所
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