Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
文献类型：期刊论文
| ; | |
| 作者 | Liu, Yang; Zhao, Jia; Yuan, Cadmus Chang-Ann; Zhang, Guoqi Q; Sun, Fenglian |
| 刊名 | ieee transactions on components packaging and manufacturing technology
 ; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
|
| 出版日期 | 2014 ; 2014 |
| 卷号 | 4期号:11页码:1754-1759 |
| 学科主题 | 半导体器件 ; 半导体器件 |
| 收录类别 | SCI |
| 语种 | 英语 ; 英语 |
| 公开日期 | 2015-03-20 ; 2015-03-20 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/26098]  |
| 专题 | 半导体研究所_中科院半导体照明研发中心 |
| 推荐引用方式 GB/T 7714 | Liu, Yang,Zhao, Jia,Yuan, Cadmus Chang-Ann,et al. Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering, Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering[J]. ieee transactions on components packaging and manufacturing technology, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2014, 2014,4, 4(11):1754-1759, 1754-1759. |
| APA | Liu, Yang,Zhao, Jia,Yuan, Cadmus Chang-Ann,Zhang, Guoqi Q,&Sun, Fenglian.(2014).Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering.ieee transactions on components packaging and manufacturing technology,4(11),1754-1759. |
| MLA | Liu, Yang,et al."Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering".ieee transactions on components packaging and manufacturing technology 4.11(2014):1754-1759. |
入库方式： OAI收割
来源：半导体研究所
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