Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
文献类型：期刊论文
| ; | |
| 作者 | Liu, Yang; Meerwijk, Joost; Luo, Liangliang; Zhang, Honglin; Sun, Fenglian; Yuan, Cadmus A.; Zhang, Guoqi |
| 刊名 | journal of materials science-materials in electronics
 ; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
|
| 出版日期 | 2014 ; 2014 |
| 卷号 | 25期号:11页码:4954-4959 |
| 学科主题 | 半导体器件 ; 半导体器件 |
| 收录类别 | SCI |
| 语种 | 英语 ; 英语 |
| 公开日期 | 2015-03-20 ; 2015-03-20 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/26099]  |
| 专题 | 半导体研究所_中科院半导体照明研发中心 |
| 推荐引用方式 GB/T 7714 | Liu, Yang,Meerwijk, Joost,Luo, Liangliang,et al. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging, Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging[J]. journal of materials science-materials in electronics, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014, 2014,25, 25(11):4954-4959, 4954-4959. |
| APA | Liu, Yang.,Meerwijk, Joost.,Luo, Liangliang.,Zhang, Honglin.,Sun, Fenglian.,...&Zhang, Guoqi.(2014).Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging.journal of materials science-materials in electronics,25(11),4954-4959. |
| MLA | Liu, Yang,et al."Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging".journal of materials science-materials in electronics 25.11(2014):4954-4959. |
入库方式： OAI收割
来源：半导体研究所
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