Thermal and mechanical effects of voids within flip chip soldering in LED packages
文献类型：期刊论文
| ; | |
| 作者 | Liu, Y; Leung, SYY; Zhao, J; Wong, CKY; Yuan, CA; Zhang, GQ; Sun, FL; Luo, LL |
| 刊名 | microelectronics reliability
 ; MICROELECTRONICS RELIABILITY
|
| 出版日期 | 2014 ; 2014 |
| 卷号 | 54期号:9-10页码:2028-2033 |
| 学科主题 | 半导体器件 ; 半导体器件 |
| 收录类别 | SCI |
| 语种 | 英语 ; 英语 |
| 公开日期 | 2015-03-25 ; 2015-03-25 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/26184]  |
| 专题 | 半导体研究所_中科院半导体照明研发中心 |
| 推荐引用方式 GB/T 7714 | Liu, Y,Leung, SYY,Zhao, J,et al. Thermal and mechanical effects of voids within flip chip soldering in LED packages, Thermal and mechanical effects of voids within flip chip soldering in LED packages[J]. microelectronics reliability, MICROELECTRONICS RELIABILITY,2014, 2014,54, 54(9-10):2028-2033, 2028-2033. |
| APA | Liu, Y.,Leung, SYY.,Zhao, J.,Wong, CKY.,Yuan, CA.,...&Luo, LL.(2014).Thermal and mechanical effects of voids within flip chip soldering in LED packages.microelectronics reliability,54(9-10),2028-2033. |
| MLA | Liu, Y,et al."Thermal and mechanical effects of voids within flip chip soldering in LED packages".microelectronics reliability 54.9-10(2014):2028-2033. |
入库方式： OAI收割
来源：半导体研究所
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