Electrochemical Switching with 3D DNA Tetrahedral Nanostructures Self-Assembled at Gold Electrodes
文献类型:期刊论文
作者 | Abi, A ; Lin, MH ; Pei, H ; Fan, CH ; Ferapontova, EE ; Zuo, XL |
刊名 | ACS APPLIED MATERIALS & INTERFACES
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出版日期 | 2014 |
卷号 | 6期号:11页码:8928—8931 |
关键词 | TRANSPORT DUPLEXES END SENSORS |
ISSN号 | 1944-8244 |
通讯作者 | fchh@sinap.ac.cn ; elena.ferapontova@inano.au.dk ; zuoxiaolei@sinap.ac.cn |
英文摘要 | Nanomechanical switching of functional three-dimensional (3D) DNA nanostructures is crucial for nanobiotechnological applications such as nanorobotics or self-regulating sensor and actuator devices. Here, DNA tetrahedral nanostructures self-assembled onto gold electrodes were shown to undergo the electronically addressable nanoswitching due to their mechanical reconfiguration upon external chemical stimuli. That enables construction of robust surface-tethered electronic nanodevices based on 3D DNA tetrahedra. One edge of the tetrahedron contained a partially self-complementary region with a stem-loop hairpin structure, reconfigurable upon hybridization to a complementary DNA (stimulus DNA) sequence. A non-intercalative ferrocene (Fc) redox label was attached to the reconfigurable tetrahedron edge in such a way that reconfiguration of this edge changed the distance between the electrode and Fc. |
收录类别 | SCI |
语种 | 英语 |
WOS记录号 | WOS:000337336900117 |
公开日期 | 2015-03-13 |
源URL | [http://ir.sinap.ac.cn/handle/331007/14113] ![]() |
专题 | 上海应用物理研究所_中科院上海应用物理研究所2011-2017年 |
推荐引用方式 GB/T 7714 | Abi, A,Lin, MH,Pei, H,et al. Electrochemical Switching with 3D DNA Tetrahedral Nanostructures Self-Assembled at Gold Electrodes[J]. ACS APPLIED MATERIALS & INTERFACES,2014,6(11):8928—8931. |
APA | Abi, A,Lin, MH,Pei, H,Fan, CH,Ferapontova, EE,&Zuo, XL.(2014).Electrochemical Switching with 3D DNA Tetrahedral Nanostructures Self-Assembled at Gold Electrodes.ACS APPLIED MATERIALS & INTERFACES,6(11),8928—8931. |
MLA | Abi, A,et al."Electrochemical Switching with 3D DNA Tetrahedral Nanostructures Self-Assembled at Gold Electrodes".ACS APPLIED MATERIALS & INTERFACES 6.11(2014):8928—8931. |
入库方式: OAI收割
来源:上海应用物理研究所
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