In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys
文献类型：期刊论文
| 作者 | Zhou, P ; Kang, HJ ; Cao, F ; Fu, YA ; Xiao, TQ ; Wang, TM |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 出版日期 | 2014 |
| 卷号 | 25期号:10页码:4538—4546 |
| 关键词 | LEAD-FREE SOLDER RARE-EARTH-ELEMENTS SOLID-LIQUID INTERFACE DIRECTIONAL SOLIDIFICATION ELECTRIC-CURRENT MOLTEN SN MICROSTRUCTURE JOINTS EVOLUTION SNAGCU |
| ISSN号 | 0957-4522 |
| 通讯作者 | tmwang@dlut.edu.cn |
| 英文摘要 | The growth behavior of Cu6Sn5 intermetallic compounds in rare earth (RE)-doped Sn-Cu solder alloys with an applied direct current (DC) has been in situ investigated using synchrotron radiation imaging technology. The morphological evolutions of Cu6Sn5 with various shapes of I-like, Y-like and bird-like are directly observed. After doping RE, the number of I-like and bird-like Cu6Sn5 is decreased, but the number of Y-like Cu6Sn5 is increased. The morphologies of Cu6Sn5 are more uniform and the mean lengths of Cu6Sn5 of different shapes are reduced in RE-doped alloys compared with that in RE-free alloys, which is attributed to the adsorption effect of RE. The growth orientation of Y-like Cu6Sn5 is changed after La is doped. Additionally, with an applied DC, the nucleation rate of Cu6Sn5 is increased and the growth rate is markedly enhanced resulting in the refinement of Cu6Sn5. Furthermore, the mechanisms of refinement caused by RE and DC are specifically discussed. |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000342157500051 |
| 公开日期 | 2015-03-13 |
| 源URL | [http://ir.sinap.ac.cn/handle/331007/14189]  |
| 专题 | 上海应用物理研究所_中科院上海应用物理研究所2011-2017年 |
| 推荐引用方式 GB/T 7714 | Zhou, P,Kang, HJ,Cao, F,et al. In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(10):4538—4546. |
| APA | Zhou, P,Kang, HJ,Cao, F,Fu, YA,Xiao, TQ,&Wang, TM.(2014).In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,25(10),4538—4546. |
| MLA | Zhou, P,et al."In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 25.10(2014):4538—4546. |
入库方式： OAI收割
来源：上海应用物理研究所
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