Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation
文献类型：期刊论文
| 作者 | Su, R ; Li, L ; Nie, ZH ; Zhang, QH ; Wang, YD ; Zhou, XT ; Wu, YD ; Hui, XD ; Li, XJ ; Wang, MG |
| 刊名 | APPLIED PHYSICS LETTERS
 |
| 出版日期 | 2014 |
| 卷号 | 105期号:22 |
| 关键词 | X-RAY-DIFFRACTION METALLIC MULTILAYERS ELASTIC-CONSTANTS AG/CU MULTILAYERS SYNCHROTRON STRENGTH CU AG |
| ISSN号 | 0003-6951 |
| 通讯作者 | lili_ose@sinap.ac.cn ; ydwang@mail.neu.edu.cn |
| 英文摘要 | Cu/Ag nanostructured multilayered films (NMFs) with different stacking sequences were investigated by synchrotron X-ray diffraction during the tensile deformations for interface stress study. The lattice strains were carefully traced and the stress partition, which usually occurs in the multiphase bulk metallic materials during plastic deformations, was first quantitatively analyzed in the NMFs here. The interface stress of the Cu/Ag NMFs was carefully analyzed during the tensile deformation and the results revealed that the interface stress was along the loading direction and exhibited three-stage evolution. This tensile interface stress has a detrimental effect on the deformation, leading to the early fracture of the NMFs. (c) 2014 AIP Publishing LLC. |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000346265200033 |
| 公开日期 | 2015-03-13 |
| 源URL | [http://ir.sinap.ac.cn/handle/331007/14201]  |
| 专题 | 上海应用物理研究所_中科院上海应用物理研究所2011-2017年 |
| 推荐引用方式 GB/T 7714 | Su, R,Li, L,Nie, ZH,et al. Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation[J]. APPLIED PHYSICS LETTERS,2014,105(22). |
| APA | Su, R.,Li, L.,Nie, ZH.,Zhang, QH.,Wang, YD.,...&Wang, MG.(2014).Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation.APPLIED PHYSICS LETTERS,105(22). |
| MLA | Su, R,et al."Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation".APPLIED PHYSICS LETTERS 105.22(2014). |
入库方式： OAI收割
来源：上海应用物理研究所
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