Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current
文献类型：期刊论文
| 作者 | X. M. Luo ; B. Zhang ; G. P. Zhang |
| 刊名 | Journal of Applied Physics
 |
| 出版日期 | 2014 |
| 卷号 | 116期号:10 |
| 关键词 | molecular-dynamics simulation fine-grained materials thermal fatigue damage deformation-behavior cu interconnects current stress electromigration films technology diffusion |
| ISSN号 | 0021-8979 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2015-01-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/73334]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. M. Luo,B. Zhang,G. P. Zhang. Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current[J]. Journal of Applied Physics,2014,116(10). |
| APA | X. M. Luo,B. Zhang,&G. P. Zhang.(2014).Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current.Journal of Applied Physics,116(10). |
| MLA | X. M. Luo,et al."Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current".Journal of Applied Physics 116.10(2014). |
入库方式： OAI收割
来源：金属研究所
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