Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder
文献类型：期刊论文
| 作者 | M. N. Wang ; J. Q. Wang ; W. Ke |
| 刊名 | Journal of Materials Science-Materials in Electronics
 |
| 出版日期 | 2014 |
| 卷号 | 25期号:12页码:5269-5276 |
| 关键词 | 3.5-percent nacl solution electrochemical corrosion polarization characteristics alloys surface joints |
| ISSN号 | 0957-4522 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2015-01-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/73417]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | M. N. Wang,J. Q. Wang,W. Ke. Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder[J]. Journal of Materials Science-Materials in Electronics,2014,25(12):5269-5276. |
| APA | M. N. Wang,J. Q. Wang,&W. Ke.(2014).Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder.Journal of Materials Science-Materials in Electronics,25(12),5269-5276. |
| MLA | M. N. Wang,et al."Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder".Journal of Materials Science-Materials in Electronics 25.12(2014):5269-5276. |
入库方式： OAI收割
来源：金属研究所
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