Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints
文献类型：期刊论文
| 作者 | H. Zhang ; Q. S. Zhu ; Z. Q. Liu ; L. Zhang ; H. Y. Guo ; C. M. Lai |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2014 |
| 卷号 | 30期号:9页码:928-933 |
| 关键词 | Fe-Ni alloy Under bump metallization (UBM) Intermetallic compound (IMC) Reliability High temperature storage Temperature cycling lead-free solders intermetallic compounds growth-kinetics cu metallization ag strength ball ubm |
| ISSN号 | 1005-0302 |
| 原文出处 | |
| 语种 | 英语 |
| 公开日期 | 2015-01-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/73491]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. Zhang,Q. S. Zhu,Z. Q. Liu,et al. Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints[J]. Journal of Materials Science & Technology,2014,30(9):928-933. |
| APA | H. Zhang,Q. S. Zhu,Z. Q. Liu,L. Zhang,H. Y. Guo,&C. M. Lai.(2014).Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints.Journal of Materials Science & Technology,30(9),928-933. |
| MLA | H. Zhang,et al."Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints".Journal of Materials Science & Technology 30.9(2014):928-933. |
入库方式： OAI收割
来源：金属研究所
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