Deformation analysis of hot stamping tools by thermal-fluid-mechanical coupled approach based on MpCCI
文献类型:期刊论文
作者 | T. ; Zhang Lin, S. H. ; Song, H. W. ; Cheng, M. ; Sun, J. Q. ; Cheng, M. |
刊名 | Materials Research Innovations
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出版日期 | 2014 |
卷号 | 18页码:1068-1073 |
关键词 | Hot stamping tools Deformation Coupled thermal-fluid-mechanical simulation Simulation MpCCI |
ISSN号 | 1432-8917 |
原文出处 | |
公开日期 | 2015-05-08 |
源URL | [http://ir.imr.ac.cn/handle/321006/73858] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | T.,Zhang Lin, S. H.,Song, H. W.,et al. Deformation analysis of hot stamping tools by thermal-fluid-mechanical coupled approach based on MpCCI[J]. Materials Research Innovations,2014,18:1068-1073. |
APA | T.,Zhang Lin, S. H.,Song, H. W.,Cheng, M.,Sun, J. Q.,&Cheng, M..(2014).Deformation analysis of hot stamping tools by thermal-fluid-mechanical coupled approach based on MpCCI.Materials Research Innovations,18,1068-1073. |
MLA | T.,et al."Deformation analysis of hot stamping tools by thermal-fluid-mechanical coupled approach based on MpCCI".Materials Research Innovations 18(2014):1068-1073. |
入库方式: OAI收割
来源:金属研究所
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