中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Deformation analysis of hot stamping tools by thermal-fluid-mechanical coupled approach based on MpCCI

文献类型:期刊论文

作者T. ; Zhang Lin, S. H. ; Song, H. W. ; Cheng, M. ; Sun, J. Q. ; Cheng, M.
刊名Materials Research Innovations
出版日期2014
卷号18页码:1068-1073
关键词Hot stamping tools Deformation Coupled thermal-fluid-mechanical simulation Simulation MpCCI
ISSN号1432-8917
原文出处://WOS:000346178400217
公开日期2015-05-08
源URL[http://ir.imr.ac.cn/handle/321006/73858]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
T.,Zhang Lin, S. H.,Song, H. W.,et al. Deformation analysis of hot stamping tools by thermal-fluid-mechanical coupled approach based on MpCCI[J]. Materials Research Innovations,2014,18:1068-1073.
APA T.,Zhang Lin, S. H.,Song, H. W.,Cheng, M.,Sun, J. Q.,&Cheng, M..(2014).Deformation analysis of hot stamping tools by thermal-fluid-mechanical coupled approach based on MpCCI.Materials Research Innovations,18,1068-1073.
MLA T.,et al."Deformation analysis of hot stamping tools by thermal-fluid-mechanical coupled approach based on MpCCI".Materials Research Innovations 18(2014):1068-1073.

入库方式: OAI收割

来源:金属研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。