Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study
文献类型：期刊论文
| 作者 | K. ; Kong Wang, L. Y. ; Tao, Y. S. ; Li, T. F. ; Xiong, T. Y. |
| 刊名 | Journal of Thermal Spray Technology
 |
| 出版日期 | 2015 |
| 卷号 | 24期号:42006页码:75-85 |
| 关键词 | adhesion energy bonding mechanism bonding strength cold spraying contact area finite element method (FEM) rebounding energy powder particles copper coatings deposition deformation mechanism friction solids metal |
| ISSN号 | 1059-9630 |
| 原文出处 | |
| 公开日期 | 2015-05-08 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/73953]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | K.,Kong Wang, L. Y.,Tao, Y. S.,et al. Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study[J]. Journal of Thermal Spray Technology,2015,24(42006):75-85. |
| APA | K.,Kong Wang, L. Y.,Tao, Y. S.,Li, T. F.,&Xiong, T. Y..(2015).Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study.Journal of Thermal Spray Technology,24(42006),75-85. |
| MLA | K.,et al."Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study".Journal of Thermal Spray Technology 24.42006(2015):75-85. |
入库方式： OAI收割
来源：金属研究所
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