中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Simulation of the electrohydrodynamic instability process used in the fabrication of hierarchic and hollow micro/nanostructures

文献类型:期刊论文

作者Wang Y.; Liu Z.; Wang Y.; Wang Y.; Wang Y.; Wang Y.
刊名Rsc Advances
出版日期2014
卷号4期号:27页码:13774-13781
ISSN号ISBN/2046-2069
英文摘要This article demonstrates that the electrohydrodynamic patterning process, a novel technique for the manufacturing of micro-and nano-scale structures, also allows the one-step realization of hierarchical structures and hollow structures. Through numerical simulation, it is shown that multilevel structures can be obtained if process time and applied electric voltage are optimized. As an example, the growth of structures with a width of around 187 nm and depth of 95 nm has been successfully simulated alongside structures with width of around 0.4 mu m and depth of 0.8 mu m. The width of the protrusive mask patterns is shown to determine whether hollow structures with single or multiple shapes can be formed using electric field assisted capillarity. The numerical simulation process effectively demonstrates that the realization of micro/nano-structures with hierarchic and multilevel shapes can be considered as an innovative manufacturing process for MEMS or micro/nanofluidic structures.
收录类别SCI ; EI
语种英语
源URL[http://ir.ciomp.ac.cn/handle/181722/44370]  
专题长春光学精密机械与物理研究所_中科院长春光机所知识产出
推荐引用方式
GB/T 7714
Wang Y.,Liu Z.,Wang Y.,et al. Simulation of the electrohydrodynamic instability process used in the fabrication of hierarchic and hollow micro/nanostructures[J]. Rsc Advances,2014,4(27):13774-13781.
APA Wang Y.,Liu Z.,Wang Y.,Wang Y.,Wang Y.,&Wang Y..(2014).Simulation of the electrohydrodynamic instability process used in the fabrication of hierarchic and hollow micro/nanostructures.Rsc Advances,4(27),13774-13781.
MLA Wang Y.,et al."Simulation of the electrohydrodynamic instability process used in the fabrication of hierarchic and hollow micro/nanostructures".Rsc Advances 4.27(2014):13774-13781.

入库方式: OAI收割

来源:长春光学精密机械与物理研究所

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