Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions
文献类型：期刊论文
| 作者 | Yan, Haidong1,2,3; Mei, Yunhui1,2,3; Li, Xin2,3; Zhang, Pu4 ; Lu, Guo-Quan5
|
| 刊名 | microelectronics reliability
 |
| 出版日期 | 2015-12-01 |
| 卷号 | 55期号:12页码:2532-2541 |
| 关键词 | Nanosilver paste Laser module Die-attach interface Pulse mode Reliability |
| ISSN号 | 0026-2714 |
| 产权排序 | 3 |
| 通讯作者 | mei, yh |
| 英文摘要 | this paper is mainly reported to a pulse reliability investigation of high power single emitter laser modules with nanosilver paste. comparative experiments in continuous pulse conditions for the laser modules packaged with nanosilver paste, indium and ausn solders were conducted. the results indicate that the laser modules attached by nanosilver paste have a longer-term lifetime than those with indium and ausn solders in continuous pulse conditions. transient thermal behavior and coupled thermo-mechanical behavior in continuous pulse conditions are simulated by finite element method (fem). a semi-empirical model based on arrhenius relationship is established to provide relative reliability assessments for laser modules by combining with the simulating results. (c) 2015 elsevier ltd. all rights reserved. |
| WOS标题词 | science & technology ; technology ; physical sciences |
| 学科主题 | engineering, electrical & electronic ; nanoscience & nanotechnology ; physics, applied |
| 类目[WOS] | engineering, electrical & electronic ; nanoscience & nanotechnology ; physics, applied |
| 研究领域[WOS] | engineering ; science & technology - other topics ; physics |
| 关键词[WOS] | diode bars ; semiconductor-lasers ; thermal-properties ; interface material ; indium solder ; au/sn solder ; reliability ; temperature ; packages ; failure |
| 收录类别 | SCI ; EI |
| 语种 | 英语 |
| WOS记录号 | WOS:000367773000010 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/27291]  |
| 专题 | 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
| 作者单位 | 1.Tianjin Univ, Minist Educ, Key Lab Adv Ceram & Machining Technol, Tianjin 300072, Peoples R China 2.Tianjin Univ, Tianjin Key Lab Adv Joining Technol, Tianjin 300072, Peoples R China 3.Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300072, Peoples R China 4.Chinese Acad Sci, Xian Inst Opt & Precis Mech, State Key Lab Transient Opt & Photon, Xian 710119, Peoples R China 5.Virginia Tech, Dept Mat Sci & Engn, Blacksburg, VA 24061 USA |
| 推荐引用方式 GB/T 7714 | Yan, Haidong,Mei, Yunhui,Li, Xin,et al. Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions[J]. microelectronics reliability,2015,55(12):2532-2541. |
| APA | Yan, Haidong,Mei, Yunhui,Li, Xin,Zhang, Pu,&Lu, Guo-Quan.(2015).Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions.microelectronics reliability,55(12),2532-2541. |
| MLA | Yan, Haidong,et al."Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions".microelectronics reliability 55.12(2015):2532-2541. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。