Superlens imaging lithography for high aspect ratio sub-wavelength pattern employing trilayer resist process
文献类型：期刊论文
| 作者 | Fang, Liang; Pan, Li; Wang, Changtao; Luo, Xiangang |
| 刊名 | MICROELECTRONIC ENGINEERING
 |
| 出版日期 | 2013-10-01 |
| 卷号 | 110页码:35-39 |
| 关键词 | Super lens Surface plasmon Lithography Tr-layer resist process |
| 英文摘要 | Recently, superlens imaging lithography below the diffraction limit has been experimentally verified. However, the short exposure depth owing to the near-field attribute of this method restricts its practical application. A tri-layer resist process, which increases the pattern depth through two-step dry etching, can overcome this drawback. In this paper, we investigated the scheme of superlens imaging lithography employing a tri-layer resist process and analysed the effect of the air gap between the object and the photosensitive layer on the exposure depth by finite-difference time-domain analyses. Through optimising the three layer resist thicknesses and dry-etching parameters of the tri-layer resist process, we patterned a high aspect ratio structure with half pitch of 110 nm and depth of 400 nm in our experiment. (C) 2013 Elsevier B.V. All rights reserved. |
| WOS标题词 | Science & Technology ; Technology ; Physical Sciences |
| 类目[WOS] | Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Optics ; Physics, Applied |
| 研究领域[WOS] | Engineering ; Science & Technology - Other Topics ; Optics ; Physics |
| 关键词[WOS] | DIFFRACTION LIMIT ; OPTICAL HYPERLENS ; SILVER SUPERLENS ; BILAYER RESIST ; PERFECT LENS ; REFRACTION ; LAYER |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000326003600007 |
| 公开日期 | 2015-12-24 |
| 源URL | [http://ir.ioe.ac.cn/handle/181551/1186]  |
| 专题 | 光电技术研究所_光电技术研究所被WoS收录文章 |
| 作者单位 | Chinese Acad Sci, Inst Opt & Elect, State Key Lab Opt Technol Microfabricat, Chengdu 610209, Peoples R China |
| 推荐引用方式 GB/T 7714 | Fang, Liang,Pan, Li,Wang, Changtao,et al. Superlens imaging lithography for high aspect ratio sub-wavelength pattern employing trilayer resist process[J]. MICROELECTRONIC ENGINEERING,2013,110:35-39. |
| APA | Fang, Liang,Pan, Li,Wang, Changtao,&Luo, Xiangang.(2013).Superlens imaging lithography for high aspect ratio sub-wavelength pattern employing trilayer resist process.MICROELECTRONIC ENGINEERING,110,35-39. |
| MLA | Fang, Liang,et al."Superlens imaging lithography for high aspect ratio sub-wavelength pattern employing trilayer resist process".MICROELECTRONIC ENGINEERING 110(2013):35-39. |
入库方式： OAI收割
来源：光电技术研究所
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