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Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
长春应用化学研究所 [3]
长春光学精密机械与物... [2]
福建物质结构研究所 [1]
采集方式
OAI收割 [6]
内容类型
期刊论文 [4]
会议论文 [2]
发表日期
2013 [1]
2012 [2]
2008 [2]
2006 [1]
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Polymer thin films for antireflection coatings
期刊论文
OAI收割
journal of materials chemistry c, 2013, 卷号: 1, 期号: 12, 页码: 2266-2285
Li X
;
Yu XH
;
Han YC
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2014/04/18
BLOCK-COPOLYMER LITHOGRAPHY
ORGANIZED HONEYCOMB MORPHOLOGY
ASYMMETRIC DIBLOCK COPOLYMERS
BY-LAYER FABRICATION
REFRACTIVE-INDEX
BROAD-BAND
HOMOPOLYMER BLENDS
MOLECULAR-WEIGHT
PHASE-BEHAVIOR
BREATH FIGURE
A composite hardness stamp in 184 PDMS for nanostructures transfer in high fidelity (EI CONFERENCE)
会议论文
OAI收割
2012 12th IEEE International Conference on Nanotechnology, NANO 2012, August 20, 2012 - August 23, 2012, Birmingham, United kingdom
作者:
Du J.
;
Shi L.
;
Li S.
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2013/03/25
To improve the fidelity of nanostructures in transfer process
a composite stamp with reasonable hardness distribution in 184 PDMS used to nanoimprint was studied. The stamp is composed of a stiff 184 PDMS structured layer and a soft 184 PDMS supporter layer. We studied the relationship between the hardness of the 184 PDMS and the proportion of each component in 184 PDMS. The appropriate components proportions of prepolymer and curing agent corresponding to the different region of the composite stamp were presented. The fabrication method of the stamp is also presented. Corresponding experiments were carried out by using this stamp. Kinds of nanostructures were transferred in one inch diameter area with good fidelity. The feature sizes of the structures were less than 100 nm. 2012 IEEE.
Electric-field-induced fabrication of covalently linked second-order nonlinear optical multilayer films on nonconductive substrates
期刊论文
OAI收割
journal of colloid and interface science, 2012, 卷号: 366, 期号: 1, 页码: 233-235
Wang SW
;
Zhao LS
;
Cui ZC
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2013/06/09
LANGMUIR-BLODGETT-FILMS
SELF-ASSEMBLED FILMS
BY-LAYER FABRICATION
THERMAL-STABILITY
CHROMOPHORES
NANOSCALE
EFFICIENT
POLYMERS
Dye-polyoxometalate composite films: Self-assembly, thermal and photochemical properties
期刊论文
OAI收割
Journal of Colloid and Interface Science, 2008, 卷号: 324, 期号: 1-2, 页码: 156-166
S. Y. Gao
;
R. Cao and C. P. Yang
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2013/01/22
layer-by-layer self-assembly
dye
polyoxometalate
film
property
dawson-type polyoxometalate
multilayer films
molecular films
azo-dye
tio2-assisted photodegradation
polyelectrolyte
fabrication
surfaces
layers
electrocatalyst
Preparation and application of single polyelectrolyte microcapsules possessing tunable autofluorescent properties
期刊论文
OAI收割
colloids and surfaces a-physicochemical and engineering aspects, 2008, 卷号: 329, 期号: 1-2, 页码: 58-66
Wang ZJ
;
Zhu H
;
Li D
;
Yang XR
收藏
  |  
浏览/下载:237/36
  |  
提交时间:2010/04/14
BY-LAYER APPROACH
HOLLOW CAPSULES
CROSS-LINKING
GLUTARALDEHYDE
FABRICATION
ENCAPSULATION
FILMS
TEMPLATE
STRENGTH
SHELLS
Study on the fabrication of orange micro-LED arrays for display (EI CONFERENCE)
会议论文
OAI收割
ICO20: Display Devices and Systems, August 21, 2005 - August 26, 2005, Changchun, China
作者:
Li J.
;
Wang W.
;
Wang W.
;
Zhao L.
;
Li J.
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2013/03/25
Arrays of micro-sized LEDs which can be used as microdisplays have been demonstrated in recent years. In order to reduce the input and output connections to the arrays
we employ a matrix addressable architecture
in which all the pixels in each row are connected by a common metal line on the top of the window layer (top electrode) or at the base of substrate(bottom electrode). Decreasing the size of electrodes makes for minimizing the size of device. The optic and electric isolation and good ohmic contact are also helpful to obtain superior optical and electrical performance. We describe a procedure of fabrication of AlGalnP-based orange micro-LED by wet etching. The structure of devices is etched using both isotropic and anisotropic etchant. The pixel size is about 16um 20um
and there are 1000 818 pixels in the light emitting chip whose diagonal is 1-in.