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长春光学精密机械与物... [2]
合肥物质科学研究院 [1]
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OAI收割 [3]
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会议论文 [2]
期刊论文 [1]
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2017 [1]
2010 [1]
2009 [1]
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Stray Magnetic Field Analysis of ITER Poloidal Field Converter Unit
期刊论文
OAI收割
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2017, 卷号: 45, 期号: 3, 页码: 495-500
作者:
Yang, Yong
;
Zhang, Ming
;
Song, Zhiquan
;
Xia, Minxue
;
Yu, Kexun
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2018/05/02
Electromagnetic Compatibility (Emc)
International Thermonuclear Experimental Reactor (Iter)
Isolated Phase Bus (Ipb)
Poloidal Field (Pf) Power Supply
Electromagnetic radiation test of power driver module in optical tracking system and electromagnetic compatibility (EI CONFERENCE)
会议论文
OAI收割
2010 International Conference on Computer, Mechatronics, Control and Electronic Engineering, CMCE 2010, August 24, 2010 - August 26, 2010, Changchun, China
作者:
Yu H.
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  |  
浏览/下载:31/0
  |  
提交时间:2013/03/25
In order to solve the conductive ring module's interference problems
measured the electromagnetic radiation of Power drive module
and used test results analysis the electromagnetic compatibility of the conductive ring
identified and implemented appropriate EMC (electromagnetic compatibility) measures. When optical tracking system working
test equipment can not be fixed. Therefore
from the electromagnetic radiation theory
the paper analyzed the electromagnetic radiation of the power drive module. From it
determine the EMC pre-compliance test method for electromagnetic radiation of power drive module. Based on Test results
calculate the interference voltage of wire in Conductive ring
and then determine the corresponding EMC method. The results show that
when The power drive module Radiate Electromagnetic waves
wires would coupled common mode interference voltage
its frequency is 3MHz
amplitude is about 10V
it would interfered the operation of sensor. By reducing the area of ground loops
used shielded cables
final rule out the interference. 2010 IEEE.
Signal integrity simulation design of image processor PCB combined with electromagnetic compatibility analyses based on altium designer 6 (EI CONFERENCE)
会议论文
OAI收割
2009 4th IEEE Conference on Industrial Electronics and Applications, ICIEA 2009, May 25, 2009 - May 27, 2009, Xi'an, China
Cheng Y. Q.
;
Zhu M.
;
Ge W.
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浏览/下载:27/0
  |  
提交时间:2013/03/25
With the coming of the high-speed digital system age
signal integrity (SI) and electromagnetic compatibility (EMC) should not be ignored any more. In this paper
based on basic theories of SI and EMC
the high-speed digital design method for PCB using the SI simulation tool of Altium Designer 6 and EMC analyses is introduced
and the impedance control
power integrity (PI) design and SI (reflections and crosstalk) design of a piece of image processor PCB are demonstrated in detail. The simulation results show that the impedance control is perfect
reasonable termination can improve the waveforms and control the reflections and crosstalk. 2009 IEEE.