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A comparison study of the H + CH4 and H + SiH4 reactions with eight-dimensional quantum dynamics: normal mode versus local mode in the reactant molecule vibration 期刊论文  OAI收割
THEORETICAL CHEMISTRY ACCOUNTS, 2014, 卷号: 133, 期号: 10
作者:  
Wang, Yan;  Li, Jun;  Guo, Hua;  Yang, Minghui
收藏  |  浏览/下载:34/0  |  提交时间:2015/06/24
Theoretical Studies of the Reaction Paths and Rate Constants for SiH4 + H System 期刊论文  OAI收割
Asian Journal of Chemistry, 2012, 卷号: 24, 期号: 4, 页码: 1798-1804
作者:  
Qi, Chuansong;  Sun XM(孙孝敏)
收藏  |  浏览/下载:17/0  |  提交时间:2016/04/27
Effects of Substrate Temperature on the Growth of Polycrystalline Si Films Deposited with SiH(4)+Ar 期刊论文  OAI收割
Journal of Materials Science & Technology, 2009, 卷号: 25, 期号: 4, 页码: 489-491
H. Cheng; A. M. Wu; J. Q. Xiao; N. L. Shi; L. S. Wen
收藏  |  浏览/下载:23/0  |  提交时间:2012/04/13
The effect of N/Si ratio on the a-SiiH/SiNx interface of a-SirH/SiNx TFT (EI CONFERENCE) 会议论文  OAI收割
Asia Display 2007, AD'07, March 12, 2007 - March 16, 2007, Shanghai, China
Liu J. e.; Gao W.; Liao Y.; Jing H.; Fu G.
收藏  |  浏览/下载:24/0  |  提交时间:2013/03/25
The threshold voltage of a-Si: H/SiNx TFT will shift under long time gate bias stress  it is mostly leaded by charge trapping in gate insulator and defect creation in semiconductor. And it is hard to be applied in AMOLED for TFT because of its threshold voltage shift. In allusion to the phenomenon of charge trapping  a series of SiNx insulating films in different N/Si(0. 87 -1.68) ratio were deposited by PECVD in this paper  controlling different flow ratio of source gas SiH4 and NH3  and a great deal of tests (ellipsometer  infrared absorption (FTIR) and Electron Dispersion Spectrum (EDS) test ) were done on these samples. Based on these SiNx insulators  three different capacitance samples in MIS structure were done  degraded experiments and C-V tests on these samples were done. The C-V curve shift of capacitance which contained SiNx with slightly N-rich(N/Si is bigger slightly than 1. 33) was not evident before and after degradation  this result indicated that the defect density of this type SiN x was smaller  and could restrain charge chapping in the interface of a-Si:H/SiNx effectively. So that as gate insulator of TFT  SiN x with slightly N-rich could decrease the threshold voltage shift of TFT and enhance its stability effectively.  
A surface kinetics model for the growth of Si1-xGex by UHV/CVD using SiH4/CeH4 期刊论文  OAI收割
journal of crystal growth, 2000, 卷号: 218, 期号: 2-4, 页码: 245-249
Yu Z; Li DZ; Cheng BW; Huang CJ; Lei ZL; Yu JZ; Wang QM; Liang JW
收藏  |  浏览/下载:55/0  |  提交时间:2010/08/12