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浏览/检索结果: 共350条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择作者升序作者降序发表日期升序发表日期降序题名升序题名降序提交时间升序提交时间降序 Foliar LM and SEM Insights: Investigating Epidermal Features and Its Taxonomic Implications in Some Verbenaceae Taxa 期刊论文  OAI收割 POLISH JOURNAL OF ENVIRONMENTAL STUDIES, 2025, 卷号: 34, 期号: 3, 页码: 2673-2685 作者:  Hadi, Fazal;  Dost, Sania;  Khan, Muhammad Nauman;  Ullah, Barkat;  Razzaq, Abdul   |  收藏  |  浏览/下载：43/0  |  提交时间：2025/04/21 foliar assessment  morpho-anatomy  Pakistan  scanning electron microscopy  Verbenaceae   Moire fringe imaging of heterostructures by scanning transmission electron microscopy 期刊论文  OAI收割 MICRON, 2024, 卷号: 185, 页码: 13 作者:  Hu, Wen-Tao;  Tian, Min;  Wang, Yu-Jia   |  收藏  |  浏览/下载：0/0  |  提交时间：2025/04/27 Scanning transmission electron microscopy  Moire fringes  Coherent scattering  Incoherent imaging  Heterostructure   Using Small Punch Test to Investigate the Mechanical Properties of X42 Exposed to Gaseous Hydrogen: Effect of Pressure, Pre-charge Time, Punch Velocity and Oxygen Content 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2024, 页码: 23 作者:  Wang, Hu-Yue;  Ming, Hong-Liang;  Hou, Dong-Ceng;  Wang, Jian-Qiu;  Ke, Wei   |  收藏  |  浏览/下载：0/0  |  提交时间：2025/04/27 X42 pipeline steel  Hydrogen embrittlement  Mechanical properties  Scanning electron microscopy (SEM)  Small punch test   Using Small Punch Test to Investigate the Mechanical Properties of X42 Exposed to Gaseous Hydrogen: Effect of Pressure, Pre-charge Time, Punch Velocity and Oxygen Content 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2024, 页码: 23 作者:  Wang, Hu-Yue;  Ming, Hong-Liang;  Hou, Dong-Ceng;  Wang, Jian-Qiu;  Ke, Wei   |  收藏  |  浏览/下载：0/0  |  提交时间：2025/04/27 X42 pipeline steel  Hydrogen embrittlement  Mechanical properties  Scanning electron microscopy (SEM)  Small punch test   Efficient rGO-supported CeO2-Y2O3-Nd2O3 nanocomposite electrocatalyst for water splitting (HER/OER) in alkaline medium 期刊论文  OAI收割 JOURNAL OF THE KOREAN CERAMIC SOCIETY, 2024, 页码: 20 作者:  Munawar, Tauseef;  Bashir, Ambreen;  Batoo, Khalid Mujasam;  Mukhtar, Faisal;  Nadeem, Muhammad Shahid   |  收藏  |  浏览/下载：8/0  |  提交时间：2025/11/17 Bifunctional electrocatalysts  Scanning transmission electron microscopy  Alkaline medium  Nickel foam  Oxygen evolution reaction  Hydrogen evolution reaction   TA-denseNet: Efficient hardware trust and assurance model based on feature extraction and comparison of SEM images and GDSII images 期刊论文  OAI收割 INTEGRATION-THE VLSI JOURNAL, 2024, 卷号: 95, 页码: 9 作者:  Xiao, Wei;  Zhao, Fazhan;  Zhao, Kun;  Ma, Hongtu;  Li, Qing   |  收藏  |  浏览/下载：53/0  |  提交时间：2024/02/20 Scanning electron microscopy  Deep learning  Hardware trust and assurance  Integrated circuit   Precipitation of multi-type nano-quasicrystals in a Mg-Zn-Y alloy 期刊论文  OAI收割 JOURNAL OF MAGNESIUM AND ALLOYS, 2024, 卷号: 12, 期号: 3, 页码: 12 作者:  Wang, W. Z.;  Zhou, X. Z.;  Zhang, L. F.;  Ye, H. Q.;  Yang, Z. Q.   |  收藏  |  浏览/下载：0/0  |  提交时间：2025/04/27 Quasicrystal  Mg alloys  Rapid solidification  Scanning-transmission electron microscopy   Assessment of soil aggregate pore structure after 8 years of cultivation from the parent material of a Mollisol 期刊论文  OAI收割 CATENA, 2024, 卷号: 235, 页码: 10 作者:  Ren, Lidong;  Yao, Shuihong;  Sun, Jingwei;  Zhou, Hu   |  收藏  |  浏览/下载：52/0  |  提交时间：2024/01/22 Aggregate pore structure  Mollisol  Agriculture restoration practices  SR-mu CT  Scanning electron microscopy   Formation mechanism of composite secondary phase particles in a solution-treated Si-modified Zircaloy-4 期刊论文  OAI收割 SCRIPTA MATERIALIA, 2024, 卷号: 239, 页码: 6 作者:  Ali, Muhammad;  Yuan, Fusen;  Han, Fuzhou;  Guo, Wenbin;  Ren, Jie   |  收藏  |  浏览/下载：54/0  |  提交时间：2024/01/07 Si-modified zircaloy-4  Composite secondary phase particles  Scanning/transmission electron microscopy  (STEM)  Crystallography   Novel methods for locating and matching IC cells based on standard cell libraries 期刊论文  OAI收割 MICROELECTRONIC ENGINEERING, 2024, 卷号: 283, 页码: 12 作者:  Liu, Can;  Wang, Kaige;  Li, Qing;  Zhao, Fazhan;  Zhao, Kun   |  收藏  |  浏览/下载：66/0  |  提交时间：2024/02/22 Reverse engineering  Integrated circuits  Scanning electron microscopy  Image processing  Hardware security