中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
地理科学与资源研究所 [1]
长春光学精密机械与物... [1]
沈阳自动化研究所 [1]
采集方式
OAI收割 [3]
内容类型
会议论文 [2]
期刊论文 [1]
发表日期
2026 [1]
2018 [1]
2009 [1]
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Unraveling multi-scale interactions and socioecological drivers of ecosystem services in drylands: Pathways to sustainable management in northern Xinjiang, China
期刊论文
OAI收割
JOURNAL OF GEOGRAPHICAL SCIENCES, 2026, 卷号: 36, 期号: 3, 页码: 644-668
作者:
  |  
收藏
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浏览/下载:3/0
  |  
提交时间:2026/04/16
spatiotemporal changes
ecosystem service
trade-off and synergy
driving mechanisms
management strategies
Security Classification Transmission Method Based on SDN in Industrial Networks
会议论文
OAI收割
Haikou, China, June 8-10, 2018
作者:
Shang WL(尚文利)
;
Wang, Zixiang
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收藏
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浏览/下载:57/0
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提交时间:2018/12/25
SDN
Security classification transmission
Service mechanisms
Industrial network
Study on the influence and disposal method of the micro-cracks of optical components (EI CONFERENCE)
会议论文
OAI收割
4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, November 19, 2008 - November 21, 2008, Chengdu, China
作者:
Xuan B.
;
Xie J.-J.
;
Xie J.-J.
收藏
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浏览/下载:64/0
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提交时间:2013/03/25
Micro-crack is one of the most effective factor to the intensity and service life of optical components. Owing to the micro-crack on surface
actual strength of optical components is reduced severely
even less than ten-percent of its theoretical strength. According to fracture mechanics
the mechanisms of the formation and propagation of micro-crack and the growth theory of sub-critical micro-crack are discussed in the paper firstly. Based on practice
an on-line test method disposing etching holes-the molecule-infiltrating method and the principles of acid-etching method disposing micro-crack are described. Followed by the demolishing mechanism of abrasives and a more reasonable removal redundancy of fine-grinding and polishing during
optical production is given by using abrasives in different-size orderly. 2009 SPIE.