中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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浏览/检索结果: 共17条,第1-10条 帮助

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similar to 5.9 cal ka BP Towada-Chuseri tephra from Towada volcano: a mid-Holocene marker layer from Japan to northeast China 期刊论文  OAI收割
JOURNAL OF QUATERNARY SCIENCE, 2021, 页码: 6
作者:  
Sun, Chunqing;  Plunkett, Gill;  Zhu, Zeyang;  Zhang, Lei;  Zhan, Bin
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A low-to-high friction transition in gradient nano-grained Cu and Cu-Ag alloys 期刊论文  OAI收割
FRICTION, 2020, 页码: 10
作者:  
Chen, Xiang
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Effect of distances between lens and sample surface on laser-induced breakdown spectroscopy with spatial confinement 期刊论文  OAI收割
Plasma Science & Technology, 2018, 卷号: 20, 期号: 8, 页码: 8
作者:  
Jiang, Z. H.;  Shao, J. F.;  Wang, T. F.;  Guo, J.;  Zhang, D.
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In situ synchrotron X-ray imaging on morphological evolution of dendrites in Sn-Bi hypoeutectic alloy under electric currents 期刊论文  OAI收割
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2014, 卷号: 117, 期号: 3, 页码: 1059—1066
Wang, TM; Zhu, J; Kang, HJ; Chen, ZN; Fu, YN; Huang, WX; Xiao, TQ
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Re-Os Dating of the Suoerkuduke Cu (Mo) Deposit, Fuyun County, Xinjiang, and Its Geodynamic Implications 期刊论文  OAI收割
JOURNAL OF EARTH SCIENCE, 2013, 卷号: 24, 期号: 2, 页码: 188-202
作者:  
Liu, Xiujin
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Re-Os Dating of the Suoerkuduke Cu (Mo) Deposit, Fuyun County, Xinjiang, and Its Geodynamic Implications 期刊论文  OAI收割
JOURNAL OF EARTH SCIENCE, 2013, 卷号: 24, 期号: 2, 页码: 188-202
作者:  
Liu, Xiujin;  Liu, Wei
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Re-Os Dating of the Suoerkuduke Cu (Mo) Deposit, Fuyun County, Xinjiang, and Its Geodynamic Implications 期刊论文  OAI收割
JOURNAL OF EARTH SCIENCE, 2013, 卷号: 24, 期号: 2, 页码: 188-202
作者:  
Liu, Xiujin;  Liu, Wei
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Re-Os Dating of the Suoerkuduke Cu (Mo) Deposit, Fuyun County, Xinjiang, and Its Geodynamic Implications 期刊论文  OAI收割
JOURNAL OF EARTH SCIENCE, 2013, 卷号: 24, 期号: 2, 页码: 188-202
作者:  
Liu, Xiujin;  Liu, Wei
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Experimental study on formability of bulk metallic glass as mold for microstructure replication (EI CONFERENCE) 会议论文  OAI收割
作者:  
Liu J.;  Lin J.;  Huang Y.;  Liu J.;  Liu J.
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Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints 期刊论文  OAI收割
Journal of Applied Physics, 2012, 卷号: 112, 期号: 6
Q. K. Zhang; Z. F. Zhang
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