中国科学院机构知识库网格系统: 检索

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	Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文 OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者: Chen, Yinbo; Gao, Zhaoqing; Liu, Zhi-Quan \| 收藏 \| 浏览/下载：39/0 \| 提交时间：2022/07/01 Sn-Bi-Ag solder Grain orientation Temperature gradient Aging Ag3Sn
	Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文 OAI收割 MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: - Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan 收藏 \| 浏览/下载：24/0 \| 提交时间：2017/08/17 Cu6Sn5 whiskers Ag3Sn fibers mechanical property screw dislocation
	Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文 OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏 \| 浏览/下载：27/0 \| 提交时间：2015/05/08 Intermetallic compounds (IMC) solder joint cooling rate solidification adsorption ag-cu solder cu6sn5 grains in-situ sn alloy nanoparticles ag3sn microstructure technology particles
	Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350 H. Y. Song; Q. S. Zhu; Z. G. Wang; J. K. Shang; M. Lu 收藏 \| 浏览/下载：11/0 \| 提交时间：2012/04/13 Lead-free solder Sn-Ag-Cu alloy Zn addition Tensile property Intermetallic compound sn-ag-cu free solder alloy interfacial reactions deformation reliability joints ag3sn creep