机构

• 长春光学精密机械与物... [1]

采集方式

• OAI收割 [1]

内容类型

• 会议论文 [1]

发表日期

• 2009 [1]

学科主题

筛选

浏览/检索结果: 共1条，第1-1条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Signal integrity simulation design of image processor PCB combined with electromagnetic compatibility analyses based on altium designer 6 (EI CONFERENCE) 会议论文  OAI收割 2009 4th IEEE Conference on Industrial Electronics and Applications, ICIEA 2009, May 25, 2009 - May 27, 2009, Xi'an, China Cheng Y. Q.; Zhu M.; Ge W. 收藏  |  浏览/下载：28/0  |  提交时间：2013/03/25 With the coming of the high-speed digital system age  signal integrity (SI) and electromagnetic compatibility (EMC) should not be ignored any more. In this paper  based on basic theories of SI and EMC  the high-speed digital design method for PCB using the SI simulation tool of Altium Designer 6 and EMC analyses is introduced  and the impedance control  power integrity (PI) design and SI (reflections and crosstalk) design of a piece of image processor PCB are demonstrated in detail. The simulation results show that the impedance control is perfect  reasonable termination can improve the waveforms and control the reflections and crosstalk. 2009 IEEE.