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Effects of melt convection on stray grain formation in single crystal superalloys during directed energy deposition 期刊论文  OAI收割
ADDITIVE MANUFACTURING, 2021, 卷号: 48, 页码: 19
作者:  
Lu, Nannan;  Lei, Zhenglong;  Yu, Xingfu;  Bi, Jiang;  Chen, Yanbin
  |  收藏  |  浏览/下载:53/0  |  提交时间:2022/01/27
Influence of heat-source temperature on convection-based tilt sensor output 会议论文  OAI收割
2012 International Conference on Measurement, Information and Control, MIC 2012, Harbin, China, MAY 18-20, 2012
作者:  
Zheng YH;  Peng SL(彭世镠)
收藏  |  浏览/下载:42/0  |  提交时间:2013/02/26
Thermal analysis on supersonic ellipsoidal dome (EI CONFERENCE) 会议论文  OAI收割
2nd International Conference on Multimedia Technology, ICMT 2011, July 26, 2011 - July 28, 2011, Hangzhou, China
Jiang Z.; Wei Q.; Jia H.
收藏  |  浏览/下载:33/0  |  提交时间:2013/03/25
Studied the transient thermal transfer analysis method due to a kind of supersonic ellipsoidal dome  which is a conformal dome. Illuminated the principle of transient thermal transfer analysis. Accomplished the transient thermal analysis based on the model of ellipsoidal dome  and studied the influence about the different material and the different velocity. Considered three materials consist of MgF2  Al2O3  and ZnS  and meanwhile  the velocity was Mach2.5  and the time consists of 10s  20s and 60s. The temperature initial loads were from FLUENT thermal simulation. The thermal conduction analysis and the thermal convection analysis were finished in software ANSYS  in which the entire transient thermal analysis consists of modeling  meshing element  calculating and getting the results. The different temperature distributions based on varied time were gotten about the different materials. The results from analysis showed the temperature distribution of the structure of ellipsoidal dome  which could help the following coupled thermal-structure analysis. 2011 IEEE.  
Active compensating method of sensitivity temperature drift of convection-based Tilt sensor 会议论文  OAI收割
2011 International Conference on Electronics and Optoelectronics, ICEOE 2011, Dalian, China, JUL 29-31, 2011
作者:  
Zheng YH;  Peng SL(彭世镠)
收藏  |  浏览/下载:25/0  |  提交时间:2013/02/26