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Chinese Academy of Sciences Institutional Repositories Grid
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金属研究所 [11]
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OAI收割 [17]
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期刊论文 [16]
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Microstructure and electrical conductivity of electroless copper plating layer on magnesium alloy micro-arc oxidation coating
期刊论文
OAI收割
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2022, 卷号: 32, 期号: 12, 页码: 3950-3962
作者:
Li, Tao
;
Leng, Zhong-jun
;
Wang, Xi-tao
;
Wang, Shi-fang
;
Zhang, Su-qing
  |  
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2024/01/07
electroless copper plating
electrical conductivity
MAO coating
magnesium alloy
Effect of electroless plating time and temperature on the formation and antibacterial ability of Cu-plated cement-based material
期刊论文
OAI收割
CEMENT & CONCRETE COMPOSITES, 2022, 卷号: 131
作者:
Liang, Yunchao
;
Chu, Hongqiang
;
Zeng, Youxu
;
Guo, Ming-Zhi
;
Song, Zijian
  |  
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2023/08/02
Microbial induced corrosion
Cement paste
Electroless plating
Copper
Antibacterial material
Preparation of low-fouling reverse-osmosis membranes on an Al_2O_3 carrier for desalination exploratory research
CNKI期刊论文
OAI收割
2019
作者:
Meng Zheng
;
Jing Wang
;
Baorong Hou
  |  
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2024/12/18
Low-fouling
MFI zeolite membrane
Porous alumina ceramics
Electroless copper plating
Desalination
One-step immersion plating method to deposit anticorrosion nickel-sulfur coatings on copper
期刊论文
OAI收割
Surface & Coatings Technology, 2018, 卷号: 333, 期号: 0, 页码: 163-167
作者:
Zhang XK(张兴凯)
;
Gao KX(高凯雄)
;
Wang FG(王富国)
;
Zhou Y(周妍)
;
Zhang JY(张俊彦)
  |  
收藏
  |  
浏览/下载:45/0
  |  
提交时间:2017/11/17
Immersion Plating
Nickel-sulfur Coatings
Copper
Corrosion
Electrode Potential
Effects of Pulse Bias Duty Cycle on Composition, Structure and Hardness of Ti-Cu-N Nanocomposite Films Deposited by Pulse Biased Arc Ion Plating
期刊论文
OAI收割
MATERIALS TRANSACTIONS, 2015, 卷号: 56, 期号: 10, 页码: 132-136
Wang, W.
;
Zhao, Y. H.
;
Fu, Z. B.
;
Yang, W. J.
;
Yu, B. H.
;
Liu, T. A.
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2016/04/21
pulse biased arc ion plating
duty cycle
titanium-copper-nitrogen nanocomposite films
hardness
Erosion-Corrosion Behavior of Electroless Ni-P Coating on Copper-Nickel Alloy in 3.5 wt.% Sodium Chloride Solution
期刊论文
OAI收割
Journal of Materials Engineering and Performance, 2014, 卷号: 23, 期号: 1, 页码: 230-237
B. Jiang
;
S. L. Jiang
;
A. L. Ma
;
Y. G. Zheng
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2014/03/14
copper-nickel alloy
electroless
erosion-corrosion resistance
heat
treatment
passivity
plating
electrochemical-behavior
composite coatings
nacl solutions
seawater
resistance
velocity
cu
Encapsulation and Performance of Copper-based Phase Change Macrocapsules
期刊论文
OAI收割
RARE METAL MATERIALS AND ENGINEERING, 2013, 卷号: 42, 期号: 1B, 页码: 741-744
作者:
Li Jianqiang
;
Zhang Guocai
;
Xu Zhe
;
Chen Yunfa
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2015/05/05
phase change materials of metal
copper macrocapsules
chromium plating
thermal cycles
waste heat recovery
Effect of Heat Treatment on Erosion-Corrosion Behavior of Electroless Ni-P Coatings in Saline Water
期刊论文
OAI收割
Materials and Manufacturing Processes, 2013, 卷号: 29, 期号: 1, 页码: 74-82
B. Jiang
;
S. L. Jiang
;
A. L. Ma
;
Y. G. Zheng
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2014/03/14
Amorphous
Coatings
Corrosion
CuNi 90/10
Erosion
Heat treatment
Microstructure
Ni-P plating
electrochemical-behavior
magnesium alloy
nacl solutions
copper-alloys
seawater
resistance
microstructure
phosphorus
surface
cu
A novel method of electroless plating on AZ31 magnesium alloy sheet
期刊论文
OAI收割
Journal of Materials Processing Technology, 2008, 卷号: 203, 期号: 1-3, 页码: 310-314
H. Zhao
;
Z. H. Huang
;
J. Z. Cui
收藏
  |  
浏览/下载:23/0
  |  
提交时间:2012/04/13
organic coating
interlayer
electroless plating
copper film
corrosion
copper
az91d
substrate
coatings
silver
films
Novel in situ method (vacuum assisted electroless plating) modified porous cathode for solid oxide fuel cells
期刊论文
OAI收割
Electrochemistry Communications, 2008, 卷号: 10, 期号: 6, 页码: 844-847
R. Su
;
Z. Lu
;
K. F. Chen
;
N. Ai
;
S. Y. Li
;
B. Wei
;
W. H. Su
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2012/04/13
in situ
vacuum assisted electroless plating
silver
SOFC
cathode
it-sofcs
performance
deposition
copper