中国科学院机构知识库网格系统: 检索

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	Effects of soluble organics on the settling rate of modified clay and development of improved clay formulations for harmful algal bloom control 期刊论文 OAI收割 ENVIRONMENTAL POLLUTION, 2021, 卷号: 289, 页码: 11 作者: Jiang, Wenbin; Yu, Zhiming; Cao, Xihua; Jiang, Kaiqin; Yuan, Yongquan \| 收藏 \| 浏览/下载：38/0 \| 提交时间：2021/11/30 Modified clay Humic acid Dissolved organic matter Settling rate Harmful algal blooms Particle image velocimetry
	Response of seafloor sediment composition to a strong storm event in the inner-shelf of Heini Bay, China 期刊论文 OAI收割 CONTINENTAL SHELF RESEARCH, 2019, 卷号: 175, 页码: 1-11 作者: Liu, Yanxia; Huang, Haijun; Liu, Xiao; Yan, Liwen; Zhang, Zehua \| 收藏 \| 浏览/下载：60/0 \| 提交时间：2019/05/15 Inner-shelf deposition Storm events Grain-size distribution Settling sediment particle Storm sedimentary record Heini Bay
	单颗粒-电感耦合等离子体质谱测定金纳米颗粒期刊论文 OAI收割分析化学, 2018, 卷号: 46, 期号: 6, 页码: 925-930 作者: 罗瑞平; 郑令娜; 丰伟悦; 王萌; Luo, RP \| 收藏 \| 浏览/下载：19/0 \| 提交时间：2019/10/11 Gold nanoparticles Single particle inductively coupled plasma mass spectrometry Dwell time Settling time
	Characteristics and flux of settling particulate matter in neritic waters: The southern Yellow Sea and the East China Sea 期刊论文 OAI收割 DEEP-SEA RESEARCH PART II-TOPICAL STUDIES IN OCEANOGRAPHY, 2010, 卷号: 57, 期号: 11-12, 页码: 1058-1063 作者: Guo, Xuewu; Zhang, Yansong; Zhang, Feijun; Cao, Qiyuan \| 收藏 \| 浏览/下载：18/0 \| 提交时间：2010/12/24 Settling Particulate Matter Particle Flux Resuspension Lateral Advection Yellow Sea East China Sea
	Effects Of Subgrid-Scale Modeling On Lagrangian Statistics In Large-Eddy Simulation 期刊论文 OAI收割 Journal of Turbulence, 2008, 页码: 1-24 作者: Yang Y(杨越); He GW(何国威); Wang LP 收藏 \| 浏览/下载：964/76 \| 提交时间：2009/08/03 Homogeneous Isotropic Turbulence Relative Diffusion Settling Velocity Time Correlations Particle Motion Heavy-Particles Fluid Particles Channel Flow Dispersion
	电子封装中的不流动芯下材料力学性能和封装可靠性的研究学位论文 OAI收割博士, 北京: 中国科学院研究生院, 2001 作者: 汪海英; 汪海英收藏 \| 浏览/下载：1871/142 \| 提交时间：2009/04/13 可控坍塌倒装芯片互连技术芯下材料机械性能颗粒含量颗粒沉积焊点寿命C4 underfill mechanical properties filler content particle settling solder joints'life